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The technical word “PicoCoulomB,” which stands for an electrical charge of the kind produced by the piezoelectric sensors they create, is abbreviated as “PCB.” Additionally, the business has registered it as a trademark.
Numerous industrial and commercial applications, such as those involving electrical, heat transfer, and hydraulic machinery, have made use of PCBs because of their non-flammability, chemical stability, high boiling point, and electrical insulating qualities. Paints, plastics, and rubber products all include plasticizers.
The global PCB sensor market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
A new PCB-less position sensor package and the single- and dual-die (totally redundant) Triaxis position sensor for automotive and industrial applications have been unveiled by Melexis, a leading global provider of microelectronics engineering services.
Based on the MLX90371 and MLX90372 Triaxis sensors’ performance, the MLX90377 is a magnetic rotational and linear position sensor IC.
It includes an ADC with signal conditioning, DSP, and an output stage driver that now supports SPC (Short PWM Code) as well as ratiometric analogue, PWM, and SENT signal formats and is based on the Triaxis Hall magnetic front-end.
It can be utilized in rotational and linear motion position sensing applications, just as other members of the Triaxis position sensor family.
ASIL-C (single die) capability, stray field resilient modes, and external pin measurement make it the perfect choice for high performance and safety-critical applications.
The SMP-3 and SMP-4 (single mold package, 3- and 4-pin) are the new package possibilities for PCB-less designs. These new packages, like Melexis’ first PCB-less package, the DMP-4 introduced in 2012, are designed to be used without a printed circuit board, lowering the cost of the overall system and enhancing mechanical integration and dependability.
These new package outlines represent nearly a decade of continual improvement based on customer input and application knowledge. They are smaller than the current DMP-4 package and offer improved mechanical integration and quality by optimization of the package body and electrical leads.
