Global Pin Grid Array (PGA) Packaging Market 2023-2030

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    GLOBAL PIN GRID ARRAY (PGA) PACKAGING MARKET

     

    INTRODUCTION

     An example of an integrated circuit packaging is a pin grid array (PGA). The pins are positioned in a regular array on the underside of the PGA’s square or rectangular packaging. The underside of the package may or may not be completely covered by the pins, which are typically spaced 2.54 mm apart.

     

    PGAs are frequently placed into a socket or through-hole installed on printed circuit boards. In comparison to previous packages like the dual in-line package, PGAs enable more pins per integrated circuit.Either the top or the bottom of the device can accommodate the chip.

     

    Wire bonding or flip chip mounting can be used to make connections. PGA packages typically use flip chip construction when the chip is on the top side and wire bonding when the chip is positioned on the pinned side. Several dies are contained in some PGA packages, such as the Zen 2 and Zen 3 Ryzen CPUs for the AM4 socket.

     

    A FC-PGA package’s backside A type of pin grid array known as a flip-chip pin grid array has the back of the die exposed and the die faces downward on top of the substrate. The die may now make more direct touch with the heatsink or other cooling system thanks to this.

     

    Intel first debuted the FC-PGA with the Coppermine core Pentium III and Celeron processors based on Socket 370, and it was later used with Pentium 4 and Celeron processors based on Socket 478.

     

    FC-PGA processors fit into motherboard sockets with zero insertion force that are based on Socket 370 and Socket 478; AMD has also utilised comparable packaging. Even in now a days, Intel processors for mobile devices are still used.

     

    GLOBAL PIN GRID ARRAY (PGA) PACKAGING MARKET SIZE AND FORECAST

     

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    The Global Pin grid array (PGA) packaging Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

     

    NEW PRODUCT LAUNCH

    VIA launched the Pin grid array (PGA) packaging in the various CPU cores are constructed using Centaur Technology’s design approach. In addition to x86 instructions, VIA C3 Processors provide an undocumented Alternative Instruction Set that enables privilege escalation and lower-level access to the CPU.

     

    VIA After Cyrix III switched to the cutting-edge “Samuel 2” core, it was rebranded as VIA C3. The addition of an on-die L2 cache slightly enhanced performance. The new name was simply a logical progression given that it was not based at all on Cyrix technology.

     

    Samuel 2 was created using a 150 nm technique in order to optimise power usage and lower production costs. The VIA C3 processor’s subsequent die shrink to a hybrid 130/150 nm manufacturing maintained its emphasis on reducing power usage.

     

    The “Samuel 2” core was unchanged in “Ezra” and “Ezra-T,” with the exception of a few minor adjustments to “Ezra- T’s” bus protocol for compatibility with Intel’s Pentium III “Tualatin” cores. For several years, VIA had the lowest power consumption in the x86 CPU market.

     

    However, the absence of design advancements resulted in performance being lagging. The retail C3 CPU was packaged in an unusual ornamental tin.

     

    COMPANY PROFILE

     

    THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

    1. How many Pin grid array (PGA) packaging are manufactured per annum globally? Who are the sub-component suppliers in different regions?
    2. Cost breakup of a Global Pin grid array (PGA) packaging and key vendor selection criteria
    3. Where is the Pin grid array (PGA) packaging manufactured? What is the average margin per unit?
    4. Market share of Global Pin grid array (PGA) packaging market manufacturers and their upcoming products
    5. Cost advantage for OEMs who manufacture Global Pin grid array (PGA) packaging in-house
    6. key predictions for next 5 years in Global Pin grid array (PGA) packaging market
    7. Average B-2-B Pin grid array (PGA) packaging market price in all segments
    8. Latest trends in Pin grid array (PGA) packaging market, by every market segment
    9. The market size (both volume and value) of the Pin grid array (PGA) packaging market in 2023-2030 and every year in between?
    10. Production breakup of Pin grid array (PGA) packaging market, by suppliers and their OEM relationship

     

    Sl no Topic
    1 Market Segmentation
    2 Scope of the report
    3 Abbreviations
    4 Research Methodology
    5 Executive Summary
    6 Introduction
    7 Insights from Industry stakeholders
    8 Cost breakdown of Product by sub-components and average profit margin
    9 Disruptive innovation in the Industry
    10 Technology trends in the Industry
    11 Consumer trends in the industry
    12 Recent Production Milestones
    13 Component Manufacturing in US, EU and China
    14 COVID-19 impact on overall market
    15 COVID-19 impact on Production of components
    16 COVID-19 impact on Point of sale
    17 Market Segmentation, Dynamics and Forecast by Geography, 2023-2030
    18 Market Segmentation, Dynamics and Forecast by Product Type, 2023-2030
    19 Market Segmentation, Dynamics and Forecast by Application, 2023-2030
    20 Market Segmentation, Dynamics and Forecast by End use, 2023-2030
    21 Product installation rate by OEM, 2023
    22 Incline/Decline in Average B-2-B selling price in past 5 years
    23 Competition from substitute products
    24 Gross margin and average profitability of suppliers
    25 New product development in past 12 months
    26 M&A in past 12 months
    27 Growth strategy of leading players
    28 Market share of vendors, 2023
    29 Company Profiles
    30 Unmet needs and opportunity for new suppliers
    31 Conclusion
    32 Appendix
     
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