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An example of an integrated circuit packaging is a pin grid array (PGA). The pins are positioned in a regular array on the underside of the PGA’s square or rectangular packaging. The underside of the package may or may not be completely covered by the pins, which are typically spaced 2.54 mm apart.
PGAs are frequently placed into a socket or through-hole installed on printed circuit boards. In comparison to previous packages like the dual in-line package, PGAs enable more pins per integrated circuit.Either the top or the bottom of the device can accommodate the chip.
Wire bonding or flip chip mounting can be used to make connections. PGA packages typically use flip chip construction when the chip is on the top side and wire bonding when the chip is positioned on the pinned side. Several dies are contained in some PGA packages, such as the Zen 2 and Zen 3 Ryzen CPUs for the AM4 socket.
A FC-PGA package’s backside A type of pin grid array known as a flip-chip pin grid array has the back of the die exposed and the die faces downward on top of the substrate. The die may now make more direct touch with the heatsink or other cooling system thanks to this.
Intel first debuted the FC-PGA with the Coppermine core Pentium III and Celeron processors based on Socket 370, and it was later used with Pentium 4 and Celeron processors based on Socket 478.
FC-PGA processors fit into motherboard sockets with zero insertion force that are based on Socket 370 and Socket 478; AMD has also utilised comparable packaging. Even in now a days, Intel processors for mobile devices are still used.
The Global Pin grid array (PGA) packaging Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
VIA launched the Pin grid array (PGA) packaging in the various CPU cores are constructed using Centaur Technology’s design approach. In addition to x86 instructions, VIA C3 Processors provide an undocumented Alternative Instruction Set that enables privilege escalation and lower-level access to the CPU.
VIA After Cyrix III switched to the cutting-edge “Samuel 2” core, it was rebranded as VIA C3. The addition of an on-die L2 cache slightly enhanced performance. The new name was simply a logical progression given that it was not based at all on Cyrix technology.
Samuel 2 was created using a 150 nm technique in order to optimise power usage and lower production costs. The VIA C3 processor’s subsequent die shrink to a hybrid 130/150 nm manufacturing maintained its emphasis on reducing power usage.
The “Samuel 2” core was unchanged in “Ezra” and “Ezra-T,” with the exception of a few minor adjustments to “Ezra- T’s” bus protocol for compatibility with Intel’s Pentium III “Tualatin” cores. For several years, VIA had the lowest power consumption in the x86 CPU market.
However, the absence of design advancements resulted in performance being lagging. The retail C3 CPU was packaged in an unusual ornamental tin.
