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Chip packing comes in the shape of plastic quad flat packages. PQFP packed chips have pins on every side, a total of typically more than 100 pins, very close spacing between pins, and pins that are extremely thin. This style of packaging is typically used with large- or ultra-large-scale integrated circuits.
The pins on the side of chips packaged in this way must be soldered to the motherboard via SMT. SMT chips can be placed without drilling holes in the motherboard since there are typically solder joints and corresponding pins built into the motherboard’s surface.
The chip can be soldered to the motherboard by aligning its pins with the proper solder connections. PQFP package has features such as simple operation, high reliability, mature process, low price, and others.
It is suited for SMT surface mounting technology to place wiring on PCB, is suitable for high frequency use, and is suitable for high frequency use. Yet, PQFP packaging’s flaws are also readily apparent.
The number of pins in the PQFP packaging technology cannot be extended due to the chip’s limited side length, which restricts the development of graphics acceleration processors. Parallel pins are another difficulty that prevents PQFP packaging from progressing further.
Due to the fact that parallel pins produce a certain amount of capacitance when transferring high frequency signals, this causes high frequency noise signals.
Long pins can also effectively absorb this interfering noise. Similar to a radio’s antenna, hundreds of “antennas” interfere with one another. preventing PQFP-packaged semiconductors from operating at higher frequencies.
Moreover, the PQFP package’s chip size to package area ratio is too low, which restricts further development of the PQFP package. PQFP was eventually replaced by BGA technology as it developed further.
The Global Plastic quad flat packaging Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The Quad Flat Pack (QFP) from FA SEMICON is a leadframe-based, plastic-encapsulated packaging with leads in the shape of gull wings on all four sides.
The QFP is designed to provide excellent levels of thermal and electrical performance while being targeted towards applications with limited budgets. The QFP gives designers the flexibility and ease to suit their packaging demands for a wide variety of device designs because it is available in a wide range of body sizes and pin counts.
Processor, Controller, DSP, ASIC, Video-DAC, PC Chip-Sets, and Gate Array are examples of applications. Automobiles, Multimedia, Home Appliances, Commercial Goods.
Feature are conformity with JEDEC Standars, Lead pitch is 0.65mm, Green materials are applicable, and Die stack
