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Polymers are an option that is chemically and fouling resistant and can reduce component weight and cost in heat transfer applications. Modern processing methods and recent developments in the production of polymeric matrix composites have made it possible to overcome the issue of decreased conductivity by fabricating thin walls and adding highly conductive reinforcements, thereby lowering the overall thermal resistance of heat sinks made from these materials.
For the purpose of cooling electronics, numerical and experimental studies relating to polymeric and composite heat sinks are published. These studies detail the thermal performance they were able to achieve as well as the benefits and drawbacks of using these materials as opposed to metallic ones.
The Global Polymeric heat sink market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
In some applications, particularly those with high ambient temperatures, polymer heat sinks may be utilised instead of commonly used heat sink materials due to their distinctive characteristics. In contrast to shiny metals, polymers come with a high surface emissivity by nature.
With the fourth power of its absolute surface temperature, the high emissivity allows for greater heat dissipation to the surrounding air. In this polymer heat sinks utilised in various ambient temperatures are used to demonstrate changes in radiative and convective heat transfer.
The observed polymer heat sinks also exhibit various thermal conductivity anisotropies and overall cooling efficiency due to the different orientations of the graphite filler brought on by the varied moulding processes.
Despite having a low thermal conductivity, polymers are already being used as polymer heat exchangers in the automotive and electronics industries, as well as in numerous active cooling applications, due to their simple production, low cost, and lightweight.
Heat sinks used in passive cooling applications cannot be used because of the amorphous nature that causes their low thermal conductivity. This drawback could be eliminated if the proper high thermal conductivity fillers were incorporated into the base polymer matrix using modern production techniques.
These composites could then be used in passive cooling applications for electronics, where they would also provide other polymer benefits. When a high ambient temperature is anticipated, high thermally conductive polymers may be employed as heat sinks.
