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Electrical equipment, semiconductor devices, and other electronic components use printed circuit heat exchangers in their thermal management systems.
Transistors and microprocessors, to mention a few consumer devices that demand high-end power electronics, use these exchangers extensively.
The Global Printed Circuit Heat Exchangers Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2027, registering a CAGR of XX% from 2024 to 2030.
PCHEs from Alfa Laval combine great robustness and integrity with an extraordinarily high heat transfer rate in a unit that is up to 85% smaller and lighter than standard shell and tube exchangers.
Excellent performance decreased installation and operational costs, and increased safety are all benefits of the unique design. Each device can be fully modified to meet the customer’s specific requirements.
Heatric manufactures Printed Circuit Heat Exchangers (PCHEs) utilising a specialised solid-state joining method known as ‘diffusion-bonding.’ This procedure results in a heat exchanger core that has no joints, welds, or failure sites. The end product has outstanding strength and integrity, as well as great efficiency and performance.
Heatric is able to build a unit that is up to 85 percent smaller and lighter than existing technologies such as shell and tube heat exchangers by combining diffusion bonding with micro-channel technology. Because of the elimination of extra piping, frames, and associated equipment, this reduction in unit size can result in significant structural cost savings.
In Printed circuit heat exchangers market following companies are profiled:
