QUAD FLAT PACKAGING MARKET

 

INTRODUCTION TO QUAD FLAT PACKAGING MARKET

Surface-mount packaging for integrated circuits is known as quad flat packaging (QFP) (ICs). In addition to having leads (or pins) on all four sides, QFPs are rectangular in design, which makes them ideal for connecting to printed circuit boards.

 

Depending on the size, QFPs can include anywhere from 32 to over 300 leads. The spacing between the leads is often measured in tenths of a millimetre, and the leads are typically organised in a grid pattern (e.g. 0.5mm, 0.65mm, 0.8mm).

 

QFPs are popular in a variety of applications, including digital and analogue circuits, memory chips, and microcontrollers. They are frequently utilised in industrial machinery and automotive electronics, as well as in consumer electronics like computers, smartphones, and game consoles.

 

 QFPs have a number of benefits over other package options, including as a compact design, a large number of pins, and simple assembly. These can, however, be more challenging to solder than other package types, particularly those with fine-pitch leads.

 QUAD FLAT PACKAGING MARKET SIZE AND FORECAST

 

 

Global quad flat packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.

 

QUAD FLAT PACKAGING MARKET NEW PRODUCT LAUNCH

The engineering team at NXP Semiconductors in Tianjin created the High Density Quad Flat Package (HDQFP), a cutting-edge IC package that delivers more lead density than the well-known QFP.

 

HDQFP packages have certain handling and board mounting requirements. By 2031[3,] the need for compact electronics is anticipated to expand significantly, driving growth in the global quad-flat-no-lead packaging market.

 

Due to its distinct advantages, Quad-Flat-No-Lead (QFN) packaging has become the most common type of packaging technique in the semiconductor industry.

 

With a CAGR of 9.4%, the Quad-Flat-No-Lead Packaging (QFN) market is anticipated to reach $1.1 billion by that year.

 

Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc., and Tianshui Huatian Technology Co. are some of the market’s top competitors.

 

In the current quad-flat-no-lead packaging business, there are primarily two types of QFN packages that are utilized for various applications: Plastic-molded and air-cavity QFN

 

QUAD FLAT PACKAGING MARKET COMPANY PROFILE

• Texas Instruments
• Analog Devices
• ON Semiconductor
• STMicroelectronics
• Renesas Electronics
• Microchip Technology Inc.
• NXP Semiconductors
• Infineon Technologies AG
• Maxim Integrated
• Cypress Semiconductor Corp

 

THIS  QUAD FLAT PACKAGING MARKET REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many quad flat packaging are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global quad flat packaging and key vendor selection criteria
3. Where is the quad flat packaging manufactured? What is the average margin per unit?
4. Market share of Global quad flat packaging market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global quad flat packaging in-house
6. key predictions for next 5 years in Global quad flat packaging market
7. Average B-2-B quad flat packaging market price in all segments
8. Latest trends in quad flat packaging market, by every market segment
9. The market size (both volume and value) of the quad flat packaging market in 2024-2030 and every year in between?
10. Production breakup of quad flat packaging market, by suppliers and their OEM relationship