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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Surface-mount packaging for integrated circuits is known as quad flat packaging (QFP) (ICs). In addition to having leads (or pins) on all four sides, QFPs are rectangular in design, which makes them ideal for connecting to printed circuit boards.
Depending on the size, QFPs can include anywhere from 32 to over 300 leads. The spacing between the leads is often measured in tenths of a millimetre, and the leads are typically organised in a grid pattern (e.g. 0.5mm, 0.65mm, 0.8mm).
QFPs are popular in a variety of applications, including digital and analogue circuits, memory chips, and microcontrollers. They are frequently utilised in industrial machinery and automotive electronics, as well as in consumer electronics like computers, smartphones, and game consoles.
QFPs have a number of benefits over other package options, including as a compact design, a large number of pins, and simple assembly. These can, however, be more challenging to solder than other package types, particularly those with fine-pitch leads.
Global quad flat packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The engineering team at NXP Semiconductors in Tianjin created the High Density Quad Flat Package (HDQFP), a cutting-edge IC package that delivers more lead density than the well-known QFP.
HDQFP packages have certain handling and board mounting requirements. By 2031[3,] the need for compact electronics is anticipated to expand significantly, driving growth in the global quad-flat-no-lead packaging market.
Due to its distinct advantages, Quad-Flat-No-Lead (QFN) packaging has become the most common type of packaging technique in the semiconductor industry.
With a CAGR of 9.4%, the Quad-Flat-No-Lead Packaging (QFN) market is anticipated to reach $1.1 billion by that year.
Amkor Technology, Inc., Texas Instruments Incorporated, Microchip Technology Inc., STATS ChipPAC Pte Ltd, ASE, NXP Semiconductors, JCET Group, Powertech Technology Inc., and Tianshui Huatian Technology Co. are some of the market's top competitors.
In the current quad-flat-no-lead packaging business, there are primarily two types of QFN packages that are utilized for various applications: Plastic-molded and air-cavity QFN
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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