Rad-hard data converters are perfect for satellite applications, such as telemetry and imaging, as well as more broadly for high-performance signal chains because they combine precision, high speed, and ultra-low power dissipation.
12- and 14-bit analog-to-digital converters and high-resolution digital-to-analog converters come in hermetic ceramic packages and meet the most rigorous radiation immunity standards for space applications. They were developed and manufactured using radiation-hardening design rules on proven CMOS or silicon-germanium technologies.
The Global Radiation tolerant data converter Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
A new line of radiation-tolerant data devices for satellite power management systems was introduced by Renesas Electronics Corporation, a leading provider of cutting-edge semiconductor solutions. The point-of-load buck regulator ISL71001SLHM/SEHM, the digital isolators ISL71610SLHM and ISL71710SLHM, and the 100V GaN FET and integrated low-side driver ISL73033SLHM are the four new devices.
The new portfolio provides space-grade solutions to missions in medium/geosynchronous Earth orbit with longer lifetime requirements, as well as small satellite and higher density electronics, while reducing size, weight, and power costs. It does this by combining rad-hard assurance levels with the board area savings and cost advantages of plastic packaging.
Combined, Renesas’ IC family supports a variety of orbital trajectories, offering the radiation performance and ideal cost-benefit ratio needed for a range of satellite payloads and subsystems.
Hermetically sealed ceramic packaging were nearly always used in the past to manufacture radiation-hardened integrated circuits, which provided the necessary durability but at a cost in terms of size and weight. The new Renesas rad-hard plastic ICs assist clients in lowering the cost and footprint of their devices without sacrificing performance.
The new devices have QMLV-like production level testing, and all devices will undergo Radiation Lot Acceptance Testing in order to guarantee that the plastic ICs comply to the highest quality for operation in challenging space settings.
The production test flow complies with SAE AS6294/1 for plastic encapsulated microelectronics in space and comprises 100 percent CSAM, X-ray, temperature cycling, static and dynamic burn in, and visual inspection. Lot Assurance Testing for HAST, Life Testing, and Moisture Sensitivity is a further screening method that is applied to each assembly and wafer lot product.
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