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A technique for etching used in microfabrication is reactive-ion etching (RIE). RIE is a form of dry etching that differs from wet etching in its properties.
To remove material that has been deposited on wafers, RIE employs chemically reactive plasma. An electromagnetic field produces the plasma in a low-pressure (vacuum) environment. The wafer surface is attacked by high-energy ions from the plasma, which react with it.
The substrate being treated is placed on a powered electrode, and RF power is utilised to ignite the plasma. The driven electrode increases the substrate’s negative bias, accelerating ions and enhancing surface bombardment.
A far lower risk of substrate damage results from the fact that the accelerating voltages experienced by ions during a RIE process are significantly lower than those used for physical etching procedures.
The Global Reactive Ion etch market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
For IC failure analysis applications, the Corial 200FA combines the benefits of high rates with low total cost of ownership.
The simple, direct loading of packaged dies and dies up to 10×10 mm is a feature of this equipment, which is present in significant fabs all over the world.
The ultra-high-density plasma source is used by the Corial 200FA RIE plasma etcher, which is intended for etching polymers and dielectrics.
The hollow cathode discharge concept used in the cathode design results in a tiny plasma volume of just a few cubic centimetres. It works effectively for deprocessing packaged die and die for IC failure analysis.
