RFID bonding is the process of connecting an RFID tag’s chip or its RFID tag to an object. Radio frequency identification (usually in the form of RFID tags). These are made up of an antenna and a microchip that emit a frequency that a reader may pick up on.
The use of RFID tags is now widespread; they can be found in bank cards, ski passes, library books, security tags, entry fobs, transport cards, and ticketing, as well as more rugged applications like vehicle tracking, medical equipment tracking, logistics/inventory management, and tool tracking, to name a few.
The Global RFID bonding Adhesives market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Specialty RFID adhesive was introduced by Delo. To attach RFID tag chips to a label substrate, Delo has created a specialised adhesive.
For use in the RFID sector as well as other electronic packaging applications, Delomonopox AD268 epoxy resin is an anisotropic electrically conductive glue. Their adhesive is more humidity resistant than others.
Due to this, it is the perfect option for applications where dependability is crucial, such as the protection of premium goods against plagiarism in passports, train tickets, and other documents.
Chips as small as 400 m are bonded to specific locations on the RFID antenna using the Delomonopox AC268 material during chip attach processes, particularly in flip-chip applications.
In storage experiments conducted by Delo at 85 degrees C and 85 percent relative humidity, continued electrical conductivity on customers’ substrates was demonstrated.
Up to 20,000 microchips can be bonded per hour on a flip-chip production machine with a quick curing time of six seconds at 190 degrees C and a thermode.
PET, polyimide, FR4, copper, aluminium, and silver are just a few examples of the flexible and rigid substrates that the adhesive sticks to well. Delo has put its products through testing such as temperature shock, bending, and climate-controlled storage.
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