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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Sensor evaluation boards offer a broad range of enablement hardware for rapid sensor evaluation and development. It comes with a demonstration kit, shield development board, and breakout board for motion and pressure sensors aimed at IoT, Industrial, and Medical applications.
The Global sensor evaluation boards market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
New Bosch sensor evaluation board for rapid prototyping accelerates development.The newly launched Application Board 3.0 provides a versatile development solution that makes it quick and easy for engineers to work with all Bosch Sensortec sensors on one common platform.
The new board simplifies the evaluation and prototyping of sensors for a wide range of applications, particularly in Industry 4.0, IoT, Smart Home systems, and wrist- and head-mounted wearables.
To optimise scalability, any sensor from Bosch Sensortec, mounted on a'shuttle board,' is simply connected into the Application board's connector.
All shuttle boards have the same footprint, and Bosch Sensortec's software detects which sensor is plugged in at any given time and automatically starts the necessary programme.
This allows for the simple examination of a wide range of sensors and solutions. Prototypes can be quickly developed to evaluate various use case setups.
The new board comes in a compact form factor, measuring only 47.0 x 37.0 x 7.0mm3, making it perfect for testing sensors in portable applications. It can be supplied by a conventional 5V USB power supply or a 3.7V Li-ion battery.
An easier-to-use graphical user interface (GUI) is included in the integrated development environment (IDE) software that comes with the board for evaluating and fine-tuning sensor parameters as well as visualising and recording sensor data.
Additionally, the software speeds up the process of resolving sensor-related problems.
Application Board 3.0 is based on the Nordic Semiconductor nRF52840 chipset and features an ARM Cortex-M4F CPU.
It is built around the u-blox NINA-B302 Bluetooth Low Energy (BLE) module. It is approved and in compliance with numerous international regulations, including CE, RoHS, China RoHS, FCC, IC, VCCI, SRRC, and NCC.
The new board has 256 KB of RAM, 1 MB of internal flash, and 2 GB of external flash memory for data logging to guarantee effective and quick customization of the vast majority of IoT use cases.
It offers BLE communication and full-speed micro-USB 2.0 connectivity to connect to a host, like a PC, and send the board's logged sensor data.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |