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By compression molding a billet into the shape of a cylinder, heating it in a PTFE sintering furnace, then skiving the film off of it, engineers can create sintered, or “full density,” PTFE tape.
Unsintered PTFE tape is made by engineers by cold extruding a fine PTFE powder via a unique die. Both unsintered and sintered PTFE tape have great chemical resistance and poor resistance to cold flow, while unsintered tape has worse abrasion resistance compared to sintered tape’s moderate abrasion resistance.
For both military and commercial applications, design engineers most frequently employ PTFE tape to insulate aircraft electrical equipment hookup wire.
The Global sintered tape market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Through BGK tapes, Fraunhofer IKTS has created a unique LTCC (Low Temperature Cofired Ceramics) material that is perfect for anodic bonding with silicon because its thermal expansion coefficient has been adjusted to silicon’s.
The multilayer is anodically bonded to silicon during this procedure after being thoroughly treated and sintered. For the technology of micro sensors and microsystems, silicon and LTCC are common substrate materials.
Both materials could be combined into a single system to create microsystems that are incredibly sophisticated.
For use with the proprietary SiCer technology, Fraunhofer IKTS has created a specific LTCC tape. The foundation of the SiCer technology is a composite sintered substrate made of silicon and a glass-ceramic LTCC multilayer laminate.
The LTCC and the silicon are physically and electrically linked without the use of any additives during the sintering process at 900 °C.
The ability to create a high fit between ceramic and silicon is made possible by the zero-shrinkage in the x- and y-direction. As a result, buildings and their parts can be reduced in size.
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