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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A solder paste that encourages exceptional wetting and reduces soldering flaws. Suitable for mini-LED displays, lighting, and automotive applications in LED flip-chip packages.
Backlighting modules were first developed in response to the growing need in the display industry for improved contrast and a longer product lifespan. The tiny soldering pads in these backlighting modules present a problem. It must be applied consistently to the pads. â
The Global Solder Paste for Mini LED Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
AIM Solder is proud to announce the launch of its new AIM LUXTM Product Line. AIM Solder is a leading global manufacturer of solder assembly materials for the electronics industry.
As a major supplier to the miniLED market, AIM developed its LUX solder materials to offer solder pastes and alloys to tier one producers of LED, miniLED, and hi-power LED assemblies in order to address production issues unique to these applications.
The LUX product line combines novel flux chemistries with ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders. High production yields and great soldering performance have been demonstrated for AIM's NC259 series.
Silver migration issues are removed by using NC259 solder pastes in conjunction with the SN100C® alloy. In comparison to other low/no-silver alloys, AIM REL61TM is a low-silver alloy choice that can minimise peak reflow temperature needs and increase mechanical strength.
Under harsh thermal cycling circumstances, AIM's REL22TM doubles the service life of high-power LEDs. High tack forces, a lengthy open time, and better wetting are all features of AIM's Tacky Flux, which is ideal for high-speed dipping and mass transfer.
Over the next two to three years, the mini/microLED market is expected to rise rapidly. AIM creates sophisticated solder goods such solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and speciality alloys like indium and gold for a variety of industries.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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