Multi User License - $4,500
The specialized procedure known as Solder Paste Inspection, or SPI, assesses and inspects the solder paste deposit quality on PCBs. Solder paste is essentially powdered solder suspended in flux paste, and it ensures the accurate and fault-free deposition of solder paste on the circuit board.
Until the solder is melted during the soldering reflow process, the flux’s tacky nature keeps components in place. Most solder nowadays, including solder pastes, are constructed of lead-free alloys as a result of environmental legislation.
The global solder paste inspection equipment market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Yamaha Motor Co., Ltd. announces the availability of the YSi-SP, a high-speed 3D solder paste inspection device that allows for high-speed, high-accuracy inspections based on our “1-head solution” concept for using a single kind of head to perform different inspections.Yamaha Motor’s first solder paste inspection (SPI) device is the YSi-SP.
It is used to check the printed solder paste’s printing quality (volume, height, area, and misalignment) after it has been applied on PCBs.
With a single head, the YSi-SP performs a variety of high-speed and high-accuracy solder paste inspections, including highly precise inspections that use a Yamaha-only algorithm that combines 2D and 3D-based measurements and image resolution switching that takes advantage of super-high resolution technology.
In order to execute automatic setup modifications, automatically correct solder misalignment, and automatically convert adhesive inspection data from the dispenser, the YSi-SP can quickly coordinate with other Yamaha equipment.
The YSi-SP can be fitted with a variety of extra functions, such as bonding inspection and foreign matter inspection, in addition to providing Statistical Process Control (SPC) to carry out a wide range of statistical processing.
With the introduction of the YSi-SP, we are now able to offer all of the essential mounting process equipment under the Yamaha brand, including printers, dispensers, solder inspection devices, surface mounters, and automated optical inspection (AOI) PCB inspection devices. Clients are able to construct a production line with even higher efficiency and quality thanks to the machinery’s complete interoperability.
A new 3D SPI equipment was launched by Omron. The challenging aspects of solder paste inspection are addressed by this design. Its method for acquiring and measuring the volume of screen-printed material ensures dependability and repeatability.
The switch can be configured using software within the inspection program, and a wide chance of resolution is available to acquire the most accurate measurements. A speedy and focused improvement process is made possible by a new GUI and very accurate statistical analysis. The new VP9000 has the ability to complete a screen-printing process’s loop 3D inspection while also providing the chance to remedy any excesses.
During the production process, the deposition of solder paste is vulnerable to flaws and mistakes. Both the solder paste itself and the solder printing procedure have these flaws. So, just after screen printing, a whole paste examination is carried out. High yields, a reduction in rework and testing, and a decrease in overall scrapping costs all depend on this.
SPI and AOI systems have grown in importance in recent years, especially in sectors where safety and quality standards are important in PCB assembly lines.This system provides great accuracy with a quick cycle time. It is a high speed and high resolution 3D solder paste inspection device. The quantity and quality of the solder paste used for printing in the SMT line are crucially impacted by it.
The system incorporates a number of technological features, including enhanced warpage compensation, auto pads and component learning, auto warpage mapping capabilities, etc. Machine-to-machine closed-loop functionalities are also included in the system. Reduced costs for rework are a result of the precision of 3D measurements of area, volume, and height.
In order to promptly stop the mounting and soldering of defective SMD parts and stop the production of defective circuit boards, a novel 3D SMD measurement system was developed. This system is extremely repeatable and has the measurement accuracy required.
Aside from the usual examination of printed circuit boards, the machine is also utilised for a range of additional measuring and visual inspection applications, such as the visual inspection of odd-shaped electronic devices, medical equipment, and automobile mechanical parts.
© Copyright 2017-2023. Mobility Foresights. All Rights Reserved.