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The foundation of any solder paste is solder powder. The degree to which alloys can be customised to meet specific requirements, as well as the material’s quality and particle size, are critical.
The term “solder paste” refers to a mixture of putty-like flux and metal solder powder that is made up of tiny metal particles.
In addition to performing its regular function of clearing contaminants and oxidation from soldering surfaces, flux also acts as a temporary glue to hold surface mount components in place.
The most common alloys used to make solder powder are eutectic (tin and lead) and lead free. Solder powder can be made of a variety of alloys.
The Global Solder Powder market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
ALPHA® OM-565 HRL3, a new generation of low temperature solder paste, was launched by MacDermid Alpha Electronics Solutions.
It is a high reliability low temperature solder paste designed for a variety of assemblies to reduce flaws brought on by warpage in temperature-sensitive chip-scale packages.
With its excellent wettability, ALPHA OM-565 HRL3 solder paste is created to enable goal reflow temperatures of 175 °C and reduce post-reflow faults like Non-Wet-Open (NWO) and Head-in-Pillow (HiP).
In comparison to current low temperature options, the HRL3 alloy offers greater thermomechanical and drop shock properties.
With outstanding compatibility in contact rework applications with ALPHA certified cored wire and rework fluxes, the ALPHA OM-565 chemistry improves electrochemical performance over current low temperature solders.
The HRL3 alloy is an example of MacDermid Alpha’s dedication to offering cutting-edge low-temperature alloy solutions to satisfy the demands of next-generation electronic assembly.
Lower peak reflow temperatures are made possible by ALPHA OM-565 HRL3, which also reduces common warpage-induced defects and improves mechanical reliability in assemblies requiring larger, thinner form factor package designs that are increasingly common in the newest handheld and computing applications.
Additionally, the ALPHA HRL3 alloy is offered in bar and wire solid solder forms for use in dip and selective soldering procedures.
