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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
The foundation of any solder paste is solder powder. The degree to which alloys can be customised to meet specific requirements, as well as the material's quality and particle size, are critical.
The term "solder paste" refers to a mixture of putty-like flux and metal solder powder that is made up of tiny metal particles.
In addition to performing its regular function of clearing contaminants and oxidation from soldering surfaces, flux also acts as a temporary glue to hold surface mount components in place.
The most common alloys used to make solder powder are eutectic (tin and lead) and lead free. Solder powder can be made of a variety of alloys.
The Global Solder Powder market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
ALPHA® OM-565 HRL3, a new generation of low temperature solder paste, was launched by MacDermid Alpha Electronics Solutions.
It is a high reliability low temperature solder paste designed for a variety of assemblies to reduce flaws brought on by warpage in temperature-sensitive chip-scale packages.
With its excellent wettability, ALPHA OM-565 HRL3 solder paste is created to enable goal reflow temperatures of 175 °C and reduce post-reflow faults like Non-Wet-Open (NWO) and Head-in-Pillow (HiP).
In comparison to current low temperature options, the HRL3 alloy offers greater thermomechanical and drop shock properties.
With outstanding compatibility in contact rework applications with ALPHA certified cored wire and rework fluxes, the ALPHA OM-565 chemistry improves electrochemical performance over current low temperature solders.
The HRL3 alloy is an example of MacDermid Alpha's dedication to offering cutting-edge low-temperature alloy solutions to satisfy the demands of next-generation electronic assembly.
Lower peak reflow temperatures are made possible by ALPHA OM-565 HRL3, which also reduces common warpage-induced defects and improves mechanical reliability in assemblies requiring larger, thinner form factor package designs that are increasingly common in the newest handheld and computing applications.
Additionally, the ALPHA HRL3 alloy is offered in bar and wire solid solder forms for use in dip and selective soldering procedures.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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