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Substrate bump inspection system is an automated inspection system that quickly and accurately examines the height, diameter, and flatness of bumps put on a substrate with a large number of gang printings, a wafer, and a wafer ring.
The global substrate bump inspection system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The new Surfscan SP7XP wafer defect inspection system was introduced by KLA Corporation. This newest addition to the Surfscan family of inspectors finds even the tiniest flaws and imperfections on bare wafers and blanket films, assisting semiconductor substrate, tool, material, and chip manufacturers in meeting the exacting manufacturing quality standards required to create the most cutting-edge chips.
This guarantees the efficiency and dependability of the processors used in electronic gadgets, allowing to keep connecting remotely, engaging in virtual exploration, and learning eternally.
Surfscan SP7XP unpatterned wafer inspection system uses technologies created by KLA’s multidisciplinary team of engineers to address a variety of issues related to the integration of cutting-edge semiconductor circuits. Identifying the flaws preventing the advancement of the newest transistor technology may be the industry’s difficulty.
through KLA Instruments The Candela 8520 system increases throughput by up to 2.3X while maintaining the cutting-edge technology of the Candela CS920.
The 8520 also offers enhanced detection and classification of basal plane dislocations on SiC epitaxial wafers, as well as the capacity to identify stacking defects on SiC substrates. A motorized stage with a 200mm travel and an adaptor for wafers with a 200mm diameter are included with the Profilm3D-200.
