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Technology for Through Holes The technique of mounting involves using plated through holes to attach components with leads to a PCB. All components were assembled to the PCB with leads passing via component holes prior to the development of the SMT. Till the end of the this technology dominated the sector.
These days, the majority of components are mounted using Surface Mount Devices (SMD), which are more effective, affordable, and suited to boards with higher densities.
THT is the best material for components that will experience high heat, mechanical stress, and environmental abrasion because the bonds formed between THT components and the board are significantly stronger than those formed by SMT.
THT components are great for testing and hobbyists since they can be changed easily when prototyping.Through-hole technology is a manufacturing process used in the electronics industry.
Leads on components are inserted through holes drilled in printed circuit boards and soldered to pads on the other side, either manually or automatically using insertion mount machines.The older point-to-point building method of electronics assembly has been mostly supplanted by through-hole technology.
Every component on a standard PCB was a through-hole component from the introduction of the second generation of computers in the until the widespread use of surface-mount technology in the middle. PCBs had tracks printed on one side only at first, then both sides, and finally multi-layer boards.
The global through-hole mounting system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
There are many different sizes and mounting methods available for electrical and electronic components. Surface-mounting technology is the current equivalent of the traditional through-hole technology.
Unfortunately, distinct soldering techniques are needed for these two technologies, which are coupled in practically every electronic equipment.
The soldering process is affected by the use of two different technologies. This necessitates two soldering procedures for each board for the EMS provider. One is for surface-mounted components, and the other is for through-hole components (wave soldering).
It should go without saying that two soldering processes are substantially more expensive and take longer to produce.
