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Titanium FPGAs offer great performance with the least amount of power in a tiny physical size and are manufactured using a 16 nm process.
They enable the conversion of a small chip into an accelerated embedded computing system with a wide variety of logic element (LE) densities and compatibility with Efinix’s RISC-V SoC (system on chip) cores.
The Titanium TI60 FPGA’s Quantum computing fabric consists of reconfigurable tiles and the eXchangeable logic and routing (XLR) cell, which boosts routing effectiveness, speed, and utilisation ratios.
Along with specialised, fast DSP blocks, the fabric also features 10 K embedded memory blocks that are extremely programmable.
When combined, these capabilities provide the best performance for a variety of applications, including edge computing and
The Global Titanium FPGA market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The co-founder, CEO, and president of Efinix stated, “Since receiving first silicon last year, we have witnessed great demand for Titanium devices and have developed a large backlog of development kits and samples”.
As they work to fulfil the promise of high-performance FPGA technology to the worldwide market, they continue to build on that momentum and are on target to enter production with several new Titanium.
The company claims that titanium FPGAs have better power, performance, and area (PPA) advantages over conventional FPGA technologies and have shown power reductions of up to 70%.
By providing the density, flexibility, and performance formerly reserved for pricy, high-end FPGAs, titanium devices aim to meet demands in high-volume, mainstream markets.