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Generally, according to the machining accuracy, machining can be divided into three stages: general machining, precision machining, and ultra-precision machining. Ultra-precision machining refers to sub-micron and nanoscale precision machining.
The process methods and technical measures taken to realize these processing are called ultra-finishing technology. Coupled with measurement technology, environmental protection and materials and other issues, this technology is generally referred to as ultra-precision engineering.
Ultra-precision machining mainly includes three fields: ultra-precision machining of diamond tools, which can process various mirror surfaces. It has successfully solved the processing of large parabolic mirrors for laser fusion systems and astronomical telescopes; ultra-precision grinding processing such as coating surface processing of high-density hard disks and processing of large-scale integrated circuit substrates; ultra-precision special processing such as large-scale integrated circuit wafers are processed by electron beam and ion beam etching methods, and the line width can reach 0.1µm.
If processed by scanning tunneling electron microscope, the line width can reach 2-5nm. three different types of machining exist: ordinary, precision, and ultra-precision. Sub-micron and nanoscale precision machining is referred to as ultra-precision machining.
The techniques used to carry out these processes are referred to as ultra-finishing technology. This technique is frequently referred to as ultra-precision engineering when it is combined with measurement technology, environmental protection, materials, and other concerns.
The three main areas of ultra-precision machining are as follows: diamond tool ultra-precision machining, which can handle different mirror surfaces. Large parabolic mirror processing for laser fusion systems and astronomical telescopes, ultra-precision grinding processing, such as coating hard disc surfaces and processing large integrated circuit substrates, ultra-precision special processing, such as large integrated circuit wafer processing by electron beam and ion beam etching methods, have all been successfully resolved.
The Global Ultra High Precision Grinding machine market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Engis Corp. of Wheeling, has launched the EVG Series of ultra high-precision vertical grinding machines for the creation of ultra-smooth surfaces. The equipment is built to grind complex materials with extreme accuracy in flatness and surface quality, considerably lowering or even doing away with the requirement for subsequent lapping and going straight from grinding to final polish.
Three different variants of the new machines are offered, and each includes a programmable logic controller, a 400-rpm work-table speed, and a 2000-rpm wheel speed. With the EVG-200, sizes range from 800 x 800 x 1900 to 1050 x 1050 x 2020.
Each one has been ergonomically constructed, with simple access to the work surface and a range of chuck alternatives. There are sophisticated machine control options that enable automated workpiece thickness measurement, automatic dressing of the grinding wheel, and automated positioning of the grinding wheel in relation to the workpiece. An update to in-process thickness measuring with real-time feedback to the grinding cycle is also available for optimal control.
