By submitting this form, you are agreeing to the Terms of Use and Privacy Policy.
Wafer backgrinding is a semiconductor device fabrication technique that reduces wafer thickness to allow for stacking and high-density packaging of integrated circuits (IC).
The Goal of Back Grinding Following that, the wafer passes through the front-end procedure, followed by the rear grinding, which only grinds the back side.
This is done to eliminate chemically contaminated portions during the front-end process and to reduce chip thickness.
Wafer back grinding (or wafer thinning) is a semiconductor manufacturing method used to manage wafer thickness, which is required to manufacture ultra-thin wafers utilised in tiny electronic device stacked and high-density packing. Wafer thinning is usually a delicate operation.
The Global Wafer Backgrinding Machine Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Wafer Backgrinding System from 3M The 3M Wafer Support System for ultra-thin semiconductor wafer backgrinding has been announced by 3M.
The new technique, which is an alternative to the usual tape procedure for backgrinding, can produce wafers as thin as 20 microns.
This method enables semiconductor producers to employ current grinding equipment to make thinner wafers at faster grinding rates and higher yields.
The 3M Wafer Support System was developed in Japan by Sumitomo 3M laboratories and contains both equipment and consumables for a comprehensive approach to wafer backgrinding support difficulties.
The 3M equipment consists of a wafer mounter that uses liquid adhesive to adhere the wafer to the glass plate, a wafer demounter that separates the glass and adhesive from the wafer following the backgrinding process, and a glass cleaner/coater.
Consumable materials include 3M ultra clean UV curable spin-on glue and a light-to-heat conversion (LTHC) coating.Wafer backgrinding is a semiconductor device fabrication operation that reduces wafer thickness to allow for stacking and high-density integrated circuit packaging.
The LTHC layer allows the adhesive to be separated from the glass after the backgrinding process. The method gives producers flexibility and the ability to use their existing backgrinding equipment to obtain remarkable results.
