GLOBAL WAFER BOW AND WARP MEASUREMENT SYSTEM MARKET

INTRODUCTION

Bow is the separation between a wafer's surface and its best fit plane in the middle. The highest positive and negative deviations from the best-fit plane are added to create warp (wafer unclamped). Several factors are used to represent the wafer's shape.

Bow and Warp is a parameter reflecting the shape when the wafer is kept in its natural state without any vacuum suctioning. The difference between the wafer thickness's maximum and minimum values is the total thickness value (wafer clamped).

It is also possible to measure the front and back surfaces of the wafer in its natural state and then calculate the GBIR (TTV) based on the data. The site flatness index of the reference surface is called SFQR, and it serves as an evaluation.

 Wafer diameter, thickness, gravity, and how the wafer is held are among the elements that affect warp wafer readings.Confocal sensors are used by wafer producers in their specialised inspection systems to precisely measure each wafer's 2D flatness profile.

They then compute the bow and warp parameters using this information. On smooth, mirror-like surfaces with little noise, acuity confocal sensors perform well.

GLOBAL WAFER BOW AND WARP MEASUREMENT SYSTEM MARKET SIZE AND FORECAST

The Global Wafer bow and warp measurement systemMarket accountedfor $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.

RECENT DEVELOPMENT

The foundational components for integrated circuits, the microelectronic building blocks found in many computers, cell phones, and other devices, are silicon wafers. The production and measurement of silicon wafers is a difficult and rigorous procedure, despite the fact that they are used for many ordinary goods.

Manufacturers pay close attention to the bow, warp, and general flatness of the substrates when making silicon wafers. The bow measurement is the deviation from the median surface's median point.

In order to take measurements that are incredibly precise, the median surface's location must be understood. Depending on whether the centre point is above or below the reference plane, bow can either be a positive or negative quantity.

In contrast to bow measurements, which only use the centre point, warp measurements use the full median surface to determine the difference between the median surface's maximum and lowest distances.

COMPANY PROFILE

• Canon
• Qualcomm
• Accretech Finance Co., Ltd.
• Tosei Systems Co., Ltd.
• Nikon

THIS REPORT WILL ANSWER FOLLOWING QUESTIONS

1. How many Wafer bow and warp measurement systems are manufactured per annum globally? Who are the sub-component suppliers in different regions?
2. Cost breakup of a Global Wafer bow and warp measurement system and key vendor selection criteria
3. Where are the Wafer bow and warp measurement systems manufactured? What is the average margin per unit?
4. Market share of Global Wafer bow and warp measurement system market manufacturers and their upcoming products
5. Cost advantage for OEMs who manufacture Global Wafer bow and warp measurement system in-house
6. key predictions for next 5 years in Global Wafer bow and warp measurement system market
7. Average B-2-B Wafer bow and warp measurement system market price in all segments
8. Latest trends in Wafer bow and warp measurement system market, by every market segment
9. The market size (both volume and value) of the Wafer bow and warp measurement system market in 2023-2030 and every year in between?
10. Production breakup of Wafer bow and warp measurement system market, by suppliers and their OEM relationship