GLOBAL WAFER BUMP INSPECTION SYSTEM MARKET INTRODUCTION In a sophisticated manufacturing procedure called “wafer bumping,” metal solder balls or […]
In a sophisticated manufacturing procedure called “wafer bumping,” metal solder balls or bumps are created on the semiconductor wafer before it is diced. Wafer bumps provide communication between a device’s die and a substrate or printed circuit board.
The wafer defect detection system finds physical defects (also known as foreign materials or particles) and pattern defects on wafers while also determining their position coordinates (X, Y). Systematic and random defects are two categories of flaws.
The global wafer bump inspection system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Cyber Optics’ WX3000 Metrology and Inspection Systems for Wafer-Level. For wafer-level and advanced packaging applications, the WX3000 3D and 2D metrology and inspection system offers the ideal mix of fast speed, high resolution, and high accuracy to increase yields and productivity.
Multi-Reflection Suppression (MRS) Sensor Technology is what powers the system. In contrast to an alternative, slow method that calls for two separate scans for 2D and 3D and only samples a small number of dice, 100% 3D and 2D metrology and inspection may be accomplished simultaneously at high speed.
The Wafer Scanner 3880 System, created to be the quickest, most precise, and all-inclusive inspection and measurement solution for the swiftly evolving technologies used in advanced packaging applications, is now available, according to Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities.
The WS 3880 is utilized in 3D IC packaging and offers 3D (height) and 2D measurement and inspection of micro and standard bumps, through silicon vias (TSV), post-via-fill copper protrusions (nails), and re-distribution layers (RDL).
Additionally, it provides a 3D sensor with an incredibly high resolution made specifically for microscopic bumps less than a few microns. The WS 3880 combines performance and throughput for either randomly sampled inspection or high-volume manufacturing.
© Copyright 2017-2023. Mobility Foresights. All Rights Reserved.