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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
During the production of semiconductors, wafers are transported and stored using wafer containers. They are also known as wafer carriers and are available in a variety of materials to support particular uses, such as thermal processing.
They are made to hold or transport multiple wafers of the same size. Glass, sapphire, silicon carbide, glass, gallium arsenide, and other materials can be used as carrier wafers.
Carriers are offered in single- or multi-wafer formats, with some versions able to accommodate a variety of sizes by adjusting inline silicone supports. To make it simple to see the wafers inside, wafer carriers are transparent in hue.
The Global Wafer carrier market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Entegris introduced their 450mm wafer carriers for the next iteration. Because of their exact alignment with 450mm equipment standards, low particle generation, and quick cleaning cycles, the 450 mm P2 wafer carriers help customers ship and process SEMI M1 standard wafers in an efficient manner.
Manufacturers are facing new wafer handling challenges as the industry transitions to 450mm in order to keep the degree of cleanliness needed to produce SEMI standard M1 quality wafers. To increase the shipping and processing of 450 mm wafers, Entegris has been working directly with top silicon suppliers and OEMs.
They have delivered their 450mm wafer handling solutions to more than 50 important industry players as part of these collaborations.To guarantee smooth equipment interoperability within the fab, Entegris has improved the architecture of the MAC and FOUP carriers. Entegris' leadership and dedication to assisting the industry's transition to M1 450mm wafer quality, as well as its continued development on fully patterned 450mm wafers, are amply demonstrated by the introduction of the 450mm P2 MAC and FOUP.
The P2 MAC offers a cleaner wafer environment with enhanced protection from handling and environmentally caused particle generation thanks to its strong sealing and an optimised mechanism for "capturing" the wafer as it enters the carrier.
For improved fab efficiency, the 450mm wafer carrier design also cuts the cleaning cycle time by 25 to 50 percent. Additionally, the performance requirements of the 450mm P2 MAC shipping system have been tested to satisfy both MAC and FOSB SEMI standards.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |