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Fully automatic, with drying and cleaning features, and suited for cleaning a variety of semiconductor substrate materials after polishing, this machine effectively lowers particle contamination on the wafer surface. It is automatically operated by a manipulator in a closed environment.
This is accomplished via a particular mechanical gripper tool that uses a positioning algorithm to re-center each wafer.
Unfortunately, this slows down cleaning efficiency slightly because wafers must be carefully re-centered, which takes time. Moreover, there is a slight but considerable chance that the gripper tool contact could cause a wafer to shatter, which could reduce efficiency.
When it comes to micro-optical and microfluidic components, cleaning is essential. High throughput and reproducible production processes depend on clean, consistently high-quality raw materials.
In contrast to macro-optical components like lenses and mirrors, even the smallest impurities or flaws will cause the finished product to fail. IMT employs current semiconductor industry technologies in this area as well as a completely automatic cleaning line.
The Global Wafer cleaning robot Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
An essential step in the production of semiconductors is wafer cleaning. The photoresist, organic compounds, metals, particles, and contaminants are all removed during the wafer cleaning process. A precise wafer yield rate is then ensured by polishing the wafers with chemical solvents and water.
On the entire IC production line, wafers are cleaned before and after every procedure, which takes about the full production period. In the extremely competitive IC wafer production business, precision, efficiency, and optimization.
Only accredited system integrators and vendors are permitted to participate in the supply chains of semiconductor manufacturers due to their tight requirements for material and equipment providers.
Advantech has a long-standing relationship with a system integrator (SI) that works with a leading Taiwanese semiconductor manufacturer who was searching for a way to accelerate the cleaning and placement of wafers.
Wafer centering, which happens after the wafer is removed from the cassette, comes before the cleaning procedure.
