A piece of machinery used to release a carrier from a device wafer that has been attached with a thermosetting, UV-curable adhesive or releasing layer. It automatically cleans the residue left on the wafer after mechanical debonding.
An apparatus for debonding wafers and a process for doing so are also described. The wafer debonder includes a wafer mounter with a first stage having a flat upper surface, a second stage mounted on the upper side of the first stage, the second stage having an inclined lower surface, and a connecting piece joining the second stage to the first; a nozzle mounted to the front of the mounter, a first holder mounted to the first stage, a second holder placed on a surface perpendicular to the second stage’s inclined surface.
The liquid pumped from the nozzles breaks apart the bonds between the connected wafers. As a result, the wafer can be debonded without creating flaws like surface scratches.
Debonders are utilised all over the world for both essential process development in the lab and small scale manufacturing in the fab. With wafer and device yield in mind, these tools were created. Implement a temporary bonding and debonding procedure quickly using a well-rounded approach.
Global wafer debonder market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
-SUSS MicroTec has introduced the XBC300 Gen2, a high volume manufacturing platform for cutting-edge 3D processing. SUSS MicroTec is a leading provider of machinery and process solutions for the semiconductor and related markets. Wafers 200mm and 300mm in diameter can be debonded and cleaned using the new bonding equipment as well as permanently bonded. It is intended for both process development and manufacturing.
The new universal bonder platform, which can be customised with a variety of process modules, is appropriate for mechanical debonding procedures at room temperature as well as all significant permanent bonding processes.
Additionally supported are the relevant cleaning procedures for 3D integration and 3D packaging. The XBC300 Gen2 is capable of high force bonding procedures such as Cu-Cu, polymer, fusion, and hybrid bonding.
The XBC300 Gen2 is SUSS MicroTec’s complementary platform to its temporary wafer bonder, the XBS300, which was introduced in December 2011. It can be configured as a debonder and cleaner. In the XBS300, device wafers are briefly attached to a carrier before being released on the XBC300 Gen2 after completing all backside processing stages. Both carrier wafers and film frames can be handled by the XBC300 Gen2 debonder and cleaning.
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