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Wafer Fab Equipment Is a Process of circular silicon wafers, wafer fabrication machinery primarily employs physical and chemical techniques to build tiny, multi-layer circuits.
These microscopic operations are carried out using a variety of tools, but most of these products can be divided into a number of broad groups.
The Global Wafer Fab Equipment Market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
In order to concentrate on research and development, engineering, and testing of wafer fabrication hardware and software used to produce next-generation DRAM, NAND, and logic technologies, Lam Research has inaugurated a new India Centre for Engineering in Bengaluru.
Texas Instruments Incorporated declared that it will start building its new 300-millimetre semiconductor wafer production facilities in Sherman, Texas.
Given that the demand for semiconductors in electronics, particularly in the industrial and automotive markets, is anticipated to increase over time, the North Texas site has the capacity to house up to four fabs to meet demand. The first and second fabs’ construction is scheduled to start soon.
Bosch is opening one of the most cutting-edge wafers fabs in the world in Dresden. It is completely networked, data-driven, and self-optimising.
The Dresden facility will become a smart factory and a leader in Industry 4.0 thanks to its highly automated, totally interconnected machines and integrated processes, as well as its use of artificial intelligence (AI) techniques. The high-tech complex was formally opened virtually.
The main discrete semiconductor production base of Toshiba Electronic Devices & Storage Corporation, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture, will soon get a new 300-milimeter wafer fabrication facility for power semiconductors, according to the company’s announcement.
Two phases of construction will enable the rate of investment to be optimised in accordance with market trends. Toshiba’s capacity to produce power semiconductors will be 2.5 times greater than it was last year when Phase 1 is fully operational.
The new fab will have an earthquake-resistant structure, improved BCP systems with dual power supply lines, and the most energy-efficient manufacturing technology to lessen its impact on the environment. Additionally, it will try to reach the “RE100” objective of utilising only renewable energy sources.
The adoption of automated wafer transportation systems and artificial intelligence will boost product quality and production effectiveness.
At its annual Samsung Foundry Forum event, Samsung Electronics, a global leader in cutting-edge semiconductor technology, announced today a strengthened business strategy for its Foundry Business. At the occasion, Samsung explained its ‘Shell-First’ capacity investment strategy, which prioritises the construction of cleanrooms regardless of market conditions.
Since cleanrooms are easily accessible, fabrication equipment can be installed later and configured flexibly in response to demand. Samsung will be able to better satisfy customer needs thanks to the new investment strategy. Plans for an additional “Shell-First” manufacturing line in Taylor, which would follow the first line announced last year, as well as a potential expansion of Samsung’s global semiconductor production network were also disclosed.
There is major competition between Foundries such as TSMC, Intel and Samsung on purchasing the next-gen NA EUV Fabrication equipment, which is currently made only by ASML.
In order to establish a semiconductor fab unit, a display fab unit, and a semiconductor assembling and testing unit in the Gujarati district of Ahmedabad, Vedanta has signed two Memorandum of Understandings (MoUs).
After Vedanta and Foxconn announced their plans to establish a joint venture company in India in February of this year, the decision to move production to Gujarat was made.
The display manufacturing facility will produce Generation 8 displays for use in small, medium, and large applications, while the planned semiconductor manufacturing fab will use 28nm technology nodes. 60% of the JV will be owned by Vedanta, and the remaining 40% by Foxconn.
