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The change in wafer thickness in relation to a reference plane is referred to as wafer flatness. The greatest value of site flatness or a global flatness value can both be used to define how flat the wafer is.
The yield of various fabrication procedures and the shape of the silicon wafer can both be significantly impacted. The wafer should ideally be a flawlessly flat, spherical, and uniformly thick disc with rounded edges that conform to the specified profile.
While wafer diameter is typically not a problem, deformations and thickness fluctuations cause the wafer to depart somewhat from its ideal shape.
The adoption of various polymeric bonding media can loosen the restrictions on wafer flatness. Usually, these media can be spun onto the surface and combined to form monolithic materials. Given the adaptability of the polymer materials, there is a broad selection of bonding materials.
The Global Wafer Flatness Measurement System Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Wafer flatness is the maximum peak-to-valley irregularity that a wafer exhibits when measured in relation to a reference plane.
A flatness measuring laser or other techniques that have been certified by the industry can be used to gauge how flat a wafer is.
For the majority of applications, spin-coating is used to process the polymeric materials, which require a modest viscosity during processing and must maintain thermal stability during later processing of the bonded structure.
It features terminal epoxide groups that increase the polymer’s stability and make it a cross-linkable aromatic polymer. Little outgassing during processing makes SU-8 ideal for applications requiring moderate temperatures.
While evaluating flatness, the technique enables rapid scanning over huge surfaces. Many parameters may need to be evaluated during the production process for making wafers.
The wafer’s flatness, the overall thickness variation, and judging the calibre of the image that is printed on the surface are typical requirements.
