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The phrase “scribing” refers to the die singulation technique, which divides the wafer or substrate into individual die by first just partially cutting through it with one process tool and then breaking it apart along the scribed lines in a subsequent step.
Scribing differs from dicing in this regard since dicing only requires one process step to completely cut through the wafer. Several semiconductor technologies use scribing, but it is especially useful in the LED and III-V industries since their very thin wafers have constrained die-separation streets.
With the high cost of LED wafers, wafer space is valuable. Due to fewer damaged die than with traditional saw scribing techniques, UV lasers’ tighter, smaller, and cleaner cuts increase yields and improve die count per wafer.
IPG scribing systems provide highly accurate, production-tested procedures that maximise outcomes and provide users the freedom to change procedure parameters in response to particular application requirements.
The usual laser scribing systems made by IPG can be set up for manual loading or for completely automated part handling and unattended operation with the greatest throughput.
The Global Wafer laser scribing equipment Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Wafers used in the production of LEDs are scribed with sapphire using a specialised line-beam technique. Higher wafer yield and tighter die packing density are made possible by the thin kerf.
High scribing throughput is made possible by the line beam’s ability to maximise the use of available laser power while minimising heating effects.
Fibre laser systems are used by MPE, Inc. to etch text onto silicon and other semiconductor wafers. Other names for laser scribe include laser engraving, serialisation, and laser branding. Wafer resizing customers frequently require the services of a laser scribe.
The wafer ID text may be located close to the notch or at the water’s edge. By producing far thinner scribe lines than conventional mechanical scribing, laser scribing increases yield. Laser scribing is a non-contact method that lessens substrate damage and microcracking.
