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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Traditionally, film cameras were made via a process called discrete assembly, in which each component was made separately, tested as needed, and then put together to create the finished product.
The development of solid state imaging did not significantly alter this strategy.
The global wafer - level camera module market accounted for $XX Billion in 2022and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Wafer-level automotive camera module revealed by Omni Vision.The OVM9284 Camera Cube Chip module was introduced by Omni Vision Technologies. The business claims that it is the first automotive-grade, wafer-level camera ever made.
The OmniPixel3-GS global-shutter pixel architecture used in the OVM9284 by Omni Vision offers quantum efficiency at the 940nm wavelength for high-quality driver images in nearly complete darkness.
The integrated Omni Vision image sensor has a resolution of 1280 x 800, 3 micron pixels, and a 1/4" optical format. In order to give driver monitoring system (DMS) designers choice in placement within the cabin while remaining hidden from view, this 1 megapixel (MP) module has a modest size of 6.5 x 6.5mm.
The business claims that it boasts the lowest power usage of any automotive camera module, allowing it to operate constantly in constrained locations and at chilly temperatures for the best possible image quality.
Each and every Camera Cube Chip module can be reflow. This indicates that they can be automated surface-mount assembly equipment mounted to a printed circuit board simultaneously with other components.
The Wafer Level Optics ("WLO") laser diode collimator with integrated Diffractive Optical Element ("DOE") has been integrated into laser projectors for next-generation applications, according to Himax Technologies, Inc., a leading supplier and fabless manufacturer of display drivers and other semiconductor products.
Himax has greatly decreased the size of laser projectors, making it possible to include technologies like active 3D scanners into mobile devices, cars, augmented and virtual reality devices, and IoT applications.
The size of the existing laser projector module, for instance, can be reduced by a factor of 9 in an active sensing 3D camera projector, making it smaller than ordinary camera modules.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |