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Sensor for wafer mapping is Sensor uses a 2-segment receiving element for improved accuracy in wafer detection and LEDs as a light source for safe operation. Precise Position Detection is a feature. With Fixed Focus Reflective Beam, Red Light LED. Wafer mapping sensors are used to gauge the thickness and curvature of semiconductor wafers, among other characteristics.
This is crucial for front-end manufacturing since it can lower scrap rates and guarantee that the final product fulfills standards. Possible detection of wafers with nitride coatings. The wavelengths of light that are absorbed by nitride-coated wafers vary on the coating thickness. When a sensor employs a laser beam of a single wavelength, the beam may be fully absorbed, leading to a wafer detection error.
The global wafer mapping sensor market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
For quick and accurate identification of semiconductor wafers and slotting problems in FOUPS – front opening unified pods — Balluff’s new wafer mapping sensor, BOH00EZ, uses a very accurate photoelectric sensor.
Its highly regulated and focussed laser spot, which is specifically intended for use with extremely thin end effectors, enables it to identify wafers that are as little as a few micrometers thick with exceptional precision.
Its photoelectric Micromote technology-based sensor head, which measures just 2.4 x 1.5 x 7 mm, houses the tiniest LED sensor currently available. It can give precision in even the smallest spaces because of this.
This sensor has features that can be applied to a range of applications that call for through beam sensors in a compact space, such as life science and food and beverage applications, in addition to wafer mapping.