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A wafer positioning system tracks the movement of the wafer transport robot as it moves the wafer using one or more position sensors to detect the position of a wafer during processing.
Two optical position sensors are placed on the surface of a transparent cover that covers the wafer handling chamber as part of the wafer positioning system.
Light is directed from the position sensors through the wafer handling chamber to reflectors near the chamber floor, where it is reflected back to the position sensors. When the beam route from the position sensor to the reflector is uninterrupted, a detector inside the position sensor can detect it.
The position sensor’s output changes states as wafers are moved through the chamber because the edge of the transported wafer disrupts the position sensor’s beam path. The wafer transport robot’s position is measured when the position sensor output changes.
The Global wafer positioning system market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Lasertec Corporation announced the release of EZ300, a novel wafer edge inspection technology that will increase wafer edge yields when producing semiconductor chips. Lasertec will present the new product at SEMICON Japan Tokyo Big Sight and provide examples of how the new tool can be used efficiently.
For inspection, evaluation, and measurement of wafer edges, the EZ300 uses confocal optics, a core technology of Lasertec. It also embodies the All in One Concept, which covers all in-line inspection requirements up to root cause analysis for each defect type on a single platform.
Finding defects of interest (DOI) at wafer edges in production lines was seen as a difficult challenge. With its high-resolution confocal optics and patented software algorithm, EZ300 provides a solution to the problem by enabling automatic defect classification, including pit/bump analysis and size measurement during inspection.
Users will be able to develop in-line quality control (QC) based on statistical process control (SPC) and find the root of chip problems thanks to this. The only wafer edge inspection tools currently on the market use SEM or AFM to measure and classify defects.
The traditional approach requires a lot of time and money because it takes a while to match defect positions across several instruments.
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