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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
Scribing is a term used in the semiconductor industry to describe the die singulation technique in which the wafer or substrate is only partially cut through by one process tool and then separated into individual die by a subsequent "breaking" step that separates the wafer along the scribed lines.
A wafer is a thin disc of silicon (one of the most prevalent semiconductors on the market) or another semiconductor material. Wafers are used to make silicon-based photovoltaic cells and electronic integrated circuits (ICs). The wafer acts as the substrate in these designs.
The Global Wafer Scribing Machine Market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A scriber is a hand tool used in metalworking to mark lines on workpieces before they are machined. The use of a scriber is known as scribing, and it is merely one step in the process of marking out.
Scribing is a term used in the semiconductor industry to describe the die singulation technique in which the wafer or substrate is only partially cut through by one process tool before being divided into individual die by a subsequent "breaking" step that separates the wafer along the scribed lines.
The scribe has an extremely narrow width, usually around 100 m. To cut the wafer into pieces, an extremely thin and precise saw is required. Dicing is often done with a water-cooled circular saw with diamond-tipped teeth.
Scribing's major goal is to graphically document a discussion in a better and more consumable manner. A visual map of a discussion helps those in attendance by giving visual appeal and recording the flow of ideas so that participants can see what they are saying.
A scribing block is used to scribe lines on a work item that is being held against an angle block. The scribing block is set from a steel rule and can be adjusted with great precision. The material is marked by sliding the scribing block such that the scriber comes into light contact with the material's surface.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introdauction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in theIndustry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |