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Scrubber systems with high particle removal efficiency (PRE) are able to remove particles of all sizes off wafers without causing damage, resulting in higher product yield, lower costs, and more profitability. The system has outstanding technology, excellent customizability, and simplicity of use.
For edge-only contact during cleaning, wafers are gripped by edge grip mechanical arms and rinsed with DI water, occasionally with a chemical added. Additionally improving the cleaning experience is megasonic water delivery in a separate spin-rinse-dry area.
impurities on a silicon wafer’s surface that could be present. It is necessary to clean a wafer’s surface to get rid of any clinging debris and organic/inorganic contaminants before putting it through the fabrication process. Additionally, silicon native oxide needs to be taken out.
A wafer is a piece of semiconductor material that is shaped like a very thin disc and made of silicon, one of the most prevalent semiconductors in use today.
Silicon-based photovoltaic cells and electronic integrated circuits (ICs) are both made from wafers. The wafer acts as the substrate in these designs.
Each form of scrubber has unique applications, benefits, and potential downsides. Other names for this item are Floor Scrubbing Machines, Floor Cleaning Machines, Single Disc Scrubber Driers, Industrial Floor Scrubbers, Heavy Duty Scrubbing Machines, Three Brush Scarifier Scrubber Machines, etc.
The Global Wafer Scrubber System market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
A fully automatic cleaner, the C&D Wafer Scrubber is made to scrub substrates with a brush and/or a high pressure arm, rinse them, and then spin them dry.
While rinse, blow-off, and final dry operations take place at a middle spindle location in the chamber, brush and high pressure scrub activities are carried out at a lower processing level.
The substrate and the handling mechanism are less likely to be splashed or sprayed due to the two level spinning process and the wide diameter process container. Almost no splashback onto the substrate occurs.
For extremely high throughput requirements, the Scrubber module is also available on the P8000 Advanced Linear System and the P9000 cluster system. It can be coupled with up to 5 Scrubber modules.
The P9000 model also uses brushless motors and digital spindle controllers, which enable customizable brush pressures, increased spin torque, and extremely precise spin speeds.
