A die is electrically tested while it is still a wafer during the wafer sorting procedure. The wafer sorting procedure is carried out with the aid of apparatus referred to as wafer probes and testers.
A wafer probe is a piece of machinery that handles wafers internally before placing them on a platform known as a chuck so that they can be probed by a probe card.
The instrument known as a Probe Card is attached to a Tester and a Prober. The tool known as a tester is used to process data and deliver the wafer probing findings.
The Global Wafer Sorter market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
A new magnetic test tool for MRAM wafer sort has been launched by Hprobe. In order to increase field area and uniformity for wafer probing large MRAM arrays, the IBEX-WS test apparatus incorporates 3D magnetic field capabilities.
Additionally, it has a proprietary, special robotized 3D field calibration unit (FCU) for quick field mapping and monitoring.
According to Hprobe, compared to conventional back-end testing in high volume manufacturing, the test equipment platform integrating the new head is the only commercially available product intended to address the magnetic specificities of MRAM.
First customer shipments of the IBEX-WS were verified by Hprobe.With the H3DM-XL test head, big MRAM arrays (from megabyte to gigabyte) can be probed in a magnetic field to speed up per-bit retention testing and non-persistent bit failures in a real-world setting.
The system, which has a strong magnetic field and is uniform across a sizable surface, can be used on a single location or a number of sites. It can be applied during the stages of product creation, validation, and qualification.
The new test head is integrated using Hprobe’s unique building elements and is powered by high-end instrumentation from carefully chosen partners.
It can also be used with any kind of electric tester and any programming language. With bit cells based on Spin Transfer Torque (STT-MRAM) and Spin Orbit Torque (SOT-MRAM) magnetic tunnel junctions, the H3DM-XL is specifically made for evaluating MRAM arrays.
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