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A wafer sputtering machine is a particular kind of tool used in the semiconductor industry to sputter thin layers onto a substrate, typically a silicon wafer. A target material (often a metal) is bombarded with high-energy ions during sputtering, which causes atoms to be expelled from the target material and deposited onto the substrate.
A wafer sputtering machine typically includes a substrate holder, a vacuum chamber, a target material, and a power source to produce the ion beam. The substrate holder keeps the wafer in position while the thin film is being deposited, and the target material is often constructed of the same material.
To produce thin layers of different materials on wafers for use in integrated circuits, microprocessors, and other electronic devices, the semiconductor industry uses the sputtering technique. Other high-tech uses that call for thin films include the manufacture of solar cells, optical coatings, and other products.
The Global Wafer Sputtering Machine Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The scia Magna 200 is used for precise metal and/or dielectric layer deposition on wafer coatings. The system can be set up to meet the needs of the user thanks to its adjustable sputter modes and combinations. The technology is also appropriate for mass production in a cluster structure with software-controlled automatic production as well as small-scale R&D applications.
Features And Properties includes RF bias for stress reduction and compliance With a rotatable substrate holder, there is greater homogeneity. With helium cooling contact and an electrostatic chuck, the substrate is at a low temperature. Reactive sputtering at high deposition rates in unipolar and bipolar mode. Film characteristics can change due to variable energy substrate bombardment. Using magnetrons in a confocal configuration during co-sputtering.
