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In the semiconductor industry, a wafer thinning machine is a specialized tool used to thin semiconductor wafers to the desired thickness.
In order to increase the wafer’s mechanical strength, lower the risk of cracking, and boost the performance of the finished semiconductor devices, the procedure involves the removal of extra material from the wafer’s surface.
The wafer-thinning machine typically polishes or grinds the wafer’s surface to eliminate any extra material. The machine uses a range of polishing pads and abrasives to gradually remove the extra material until the appropriate thickness is reached.
The machine can handle numerous wafers at once and is often automated, enhancing productivity and decreasing lead time.
Wafer-thinning equipment is essential for the production of semiconductors because wafer thickness affects how well semiconductor devices work in the end.
The Global Wafer Thinning Machine Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
The first 12-inch ultra-precision wafer thinning equipment (Versatile-GP300) from Tsinghua University was formally launched and sent to a major domestic integrated circuit manufacturer, according to official Tsinghua University sources.
According to reports, the machinery was created by Professor Lu Xinchun from the Tsinghua University Department of Mechanical Engineering under the direction of Huahai Zero2IPO, the business leading the university’s accomplishment transformation project.
The technique gradually overcomes the key technologies of wafer backside ultra-precision grinding, intelligent flatness control, surface damage control, and defect control.
In order to meet the demands of ultra-precision thinning of 12-inch wafers, the products will be employed in 3D IC manufacturing, advanced packaging, and other large-scale chip manufacturing production lines.
