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A wafer handling device with robotic input and output systems under the control of a programmable controller. Each system consists of a robot, a twist and rotate, a carrier, and an automated carrier train, among other parts. The input system is used to take wafers out of their wafer pod, put them in the carrier, and then send them along the rail to a place where they can be processed.
The output system performs the opposite action, removing processed wafers from a carrier and putting them in a pod. A number of connected, articulated cantilevered arms are present on each robot. The last arm works with the controller to give location detection of system components. It contains a wand on one end and a laser emitter detector on the other.
The Global wafer transfer robot market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
Hine Automation, a Florida-based machine builder, recently improved the performance of its SL-200C Vacuum Cassette-to-Cassette-Wafer Handling System by adding precisely manufactured pulley-bushing assemblies. This machine’s job is to move silicon wafers under vacuum from a wafer cassette to a wafer processing module. Computer controllers are used to direct the movements.
Hine Automation supports original equipment manufacturers (OEMs) in the semiconductor, solar, flat-panel display, and related industries globally and specialises in creating modular and adaptable solutions for thin-film automation.
The new pulley-bushing assemblies in the SL-200C operate on an axis that drives a robot arm horizontally as it inserts silicon wafers into the machine’s process module.
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