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Different layers of materials are frequently joined together through lamination under pressure. Especially in the technology industry and for semiconductors. It enables the development of flat screens, smartphone displays, and solar cells, for example.
As opposed to the conventional roller type equipment, the wafer vacuum laminator is unique. Attaching dry film while in a vacuum and creating a hot air bag laminating process are both novel ideas.
Vacuum, pressure, temperature, and time can all be separately set up in accordance with the material being applied, and the secondary surface levelling and laminating processes can be extended.
The Global Wafer Vacuum Laminator Market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
CGI Americas introduced the new Wafer Vacuum Lamination device from C Sun. the release of the WVL-A12 wafer vacuum laminator, which applies dry coatings to wafers with exceptional accuracy, fill ability, and precision.
The system is a novel and highly cost-effective way to improve manufacturing yields and cut expenses by lowering contamination using a variety of innovative technologies.
A pre-cutting module, lamination module, levelling module, and de-taping module are all parts of the WVL-A12D, which features a special blade design.Manufacturing of three-dimensional (3D) integrated circuits (ICs), underfill lamination, moulding, CMOS image sensors, LED silicon submount packages, and MEMS substrates are among the applications for the TSV and RDL technologies.
The machine can be outfitted with a data management system that allows users to monitor and handle all process parameters using the proper software, and it is already configured to read barcodes.
Printed circuit boards, IC substrates, semiconductors, and wafer cells are all sectors that can use this unit for lamination. A flawless adhesion of the goods and the absence of air bubbles are guaranteed by the machine.
