The ability to accommodate a range of different component sizes, detector matching, and the speed with which it acquires 3D data (rotational data set minimum of 180°) are all advantages of X-ray Metrology System over optical coordinate measuring machines (CMMs) and other traditional metrology techniques.
The ability to image the interior of things made using additive manufacturing, which can have intricate internal geometries, is another advantage of X-ray scanning.
In addition, services for clients who require assistance with other X-ray Metrology System applications, such as research and development, reverse engineering for analytical and testing needs, duplication, thickness measurements, failure analysis, finite element analysis (FEA), preventative and predictive maintenance, life cycle analysis, flaw detection, porosity characteristics, and more.
The Global X-ray Metrology System market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
For sophisticated memory chip producers, KLA Corporation (NASDAQ: KLAC) has introduced the ground-breaking Axion T2000 X-ray Metrology System.
The accurate development of extraordinarily tall structures with deep, narrow holes and pits, as well as other sophisticated architectural patterns, requires control at the nanoscale level for 3D NAND and DRAM chip fabrication.
Patented innovations in the Axion T2000 enable it to measure high aspect ratio device features with a previously unheard-of level of resolution, accuracy, precision, and speed.
The Axion T2000 assists in ensuring the effective fabrication of memory chips used in applications like 5G, artificial intelligence (AI), data centers, and edge computing by identifying the minute shape irregularities that might affect memory chip performance.
With the aid of industry-exclusive X-ray technology, the Axion T2000 CD-SAXS system generates high-resolution measurements of the key dimensions and 3D forms of memory device features.
Regardless of how tall the vertical memory structure is now or will be in the future, a high flux source produces X-rays that pass through the entire thing, making it possible to measure intricate device structures.
To produce rich 3D geometrical information, diffraction images at various angles are obtained using a stage with an industry-leading dynamic range.
The assessment of numerous important device parameters and the extraction of minute deviations that may have an impact on memory chip functionality are made possible by new AcuShape algorithms.
The Axion T2000 non-destructively generates the dimensional metrology data required to assist memory makers in their efforts to monitor, optimize.
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