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Last Updated: Apr 25, 2025 | Study Period:
The ability to accommodate a range of different component sizes, detector matching, and the speed with which it acquires 3D data (rotational data set minimum of 180°) are all advantages of X-ray Metrology System over optical coordinate measuring machines (CMMs) and other traditional metrology techniques.
The ability to image the interior of things made using additive manufacturing, which can have intricate internal geometries, is another advantage of X-ray scanning.
In addition, services for clients who require assistance with other X-ray Metrology System applications, such as research and development, reverse engineering for analytical and testing needs, duplication, thickness measurements, failure analysis, finite element analysis (FEA), preventative and predictive maintenance, life cycle analysis, flaw detection, porosity characteristics, and more.
The Global X-ray Metrology System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
KLA Corporation (NASDAQ: KLAC) introduced the ground-breaking Axion T2000 X-ray Metrology System for sophisticated memory chip producers.
The accurate development of extraordinarily tall structures with deep, narrow holes and pits, as well as other sophisticated architectural patterns, requires control at the nanoscale level for 3D NAND and DRAM chip fabrication.
Patented innovations in the Axion T2000 enable it to measure high aspect ratio device features with a previously unheard-of level of resolution, accuracy, precision, and speed.
The Axion T2000 assists in ensuring the effective fabrication of memory chips used in applications like 5G, artificial intelligence (AI), data centers, and edge computing by identifying the minute shape irregularities that might affect memory chip performance.
With the aid of industry-exclusive X-ray technology, the Axion T2000 CD-SAXS system generates high-resolution measurements of the key dimensions and 3D forms of memory device features.
Regardless of how tall the vertical memory structure is now or will be in the future, a high flux source produces X-rays that pass through the entire thing, making it possible to measure intricate device structures.
To produce rich 3D geometrical information, diffraction images at various angles are obtained using a stage with an industry-leading dynamic range.
The assessment of numerous important device parameters and the extraction of minute deviations that may have an impact on memory chip functionality are made possible by new AcuShape algorithms.
The Axion T2000 non-destructively generates the dimensional metrology data required to assist memory makers in their efforts to monitor, optimize.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
21 | Product installation rate by OEM, 2023 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2023 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |