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A technique for inspecting 3D solder paste using lasers is called Soldier Paste 3D. The solder paste must be exact in order for the PCB to function properly, and this tool can aid with that.
The PCBs can develop flaws when the solder paste is off even slightly. High accuracy and simplicity define the SP3D device. Users may discover faults early and make modifications when they check to see that the solder paste is put correctly, which helps to save time and money.
The Global 3D solder automatic inspection system market accounted for $XX Billion in 2022 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2023 to 2030.
Yamaha has launched its brand-new YSi-SP High-speed 3D Solder Paste Inspection Machine. Yamaha Motor’s first solder paste inspection (SPI) device is the YSi-SP. It is used to check the printed solder paste’s printing quality (volume, height, area, and misalignment) after it has been applied on PCBs.
With a single head, the YSi-SP performs a variety of high-speed and high-accuracy solder paste inspections, including highly precise inspections that use a Yamaha-only algorithm that combines 2D and 3D-based measurements and image resolution switching that takes advantage of super-high resolution technology.
The YSi-SP can quickly work with other Yamaha machines, such as performing automatic setup changes, automatically adjusting solder misalignment, and automatically converting adhesive inspection data from the dispenser, by drawing on experience as a comprehensive manufacturer of a full lineup of surface mounting equipment.
With the introduction of the YSi-SP, we are now able to offer all of the fundamental equipment needed for mounting processes under the Yamaha brand, including printers, dispensers, solder inspection machines, surface mounters, and automated optical inspection (AOI) PCB inspection machines.
Clients are able to construct a production line with even greater efficiency and quality thanks to the machinery’s complete coordination with one another. The YSi-SP can be equipped with a variety of optional functions, such as bonding inspection and foreign matter inspection, in addition to providing Statistical Process Control (SPC) to execute a wide range of statistical processing.
