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In order to achieve vertical stacking, 3D packaging refers to 3D integration strategies that rely on conventional connecting techniques like wire bonding and flip chip. There are two types of 3D packaging: 3D wafer level packaging and 3D system in package.
Stacks of memory dies connected by wire bonds, package-on-package topologies connected by wire bonds, and flip chip technology are examples of 3D SiPs that have been used in mainstream production for some time and have a well-established infrastructure. Several technologies are vertically integrated via PoP.
Wafer level procedures like redistribution layer and wafer bumping operations are used in 3D WLP to create interconnects. A 2.5D interposer is a 3D WLP that uses through silicon vias and an RDL to join dies side by side on a silicon, glass, or organic interposer.
Chips within the package communicate with one another in all forms of 3D packaging utilising off-chip signalling, exactly like they would if they were installed in separate packages on a standard circuit board.
By using TSV interconnects to stack IC chips, 3D stacked ICs can be distinguished from monolithic 3D ICs, which use fab methods to implement 3D interconnects at the local levels of the ITRS-specified on-chip wiring hierarchy, resulting in direct vertical interconnects between device layers. NAND flash memory is frequently housed in 3D IC packages in mobile devices.
The Global 3D Stacked Die Packaging market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
In order to influence future breakthroughs in semiconductors and systems, TSMC has launched the OIP 3DFabric Alliance. The new TSMC 3DFabric Alliance is the company’s sixth OIP Alliance and the first of its kind in the semiconductor sector.
It brings together partners to speed up the development and readiness of the 3D IC ecosystem by providing a wide range of world-class products and services for semiconductor design, memory modules, substrate technology, testing, manufacturing, and packaging.
With the aid of TSMC’s 3DFabric technologies, a broad family of 3D silicon stacking and cutting-edge packaging technologies, users will be able to quickly integrate innovations at the silicon and system level and enable next-generation HPC and mobile applications.
