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The 40nm process combines ultra-low k connection material with 193 nm immersion lithography technology to improve chip performance while concurrently reducing power consumption. Additionally, the smallest SRAM (0.242 m2) and macro size were set by this procedure.As a stopgap between the 45 nm and 32 nm technologies, the 40 nanometer (nm) lithography process is a half-node semiconductor production technique.
The Global 40nm chip market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
Vietnam’s national identification card is improved with Infineon’s 40nm security chip technology. Establishing a citizen’s identity is more important than ever in the modern, digital world. As a result, an electronic ID (eID) can be used to establish legal proof of a person’s identification.
The functionality of national eIDs can be increased so that people can access government services and benefits online in addition to just being able to identify themselves as citizens. This has many benefits, especially during pandemics because it avoids the need to wait in long queues at neighbourhood government offices.
Infineon Technologies AG partnered with MK Smart, a division of MK Group, to improve the national ID card in Vietnam, making it a state-of-the-art electronic ID document.
They enable protected biometrics and digital signing to access citizenry services on public and private portals by providing the chip and its operating system on smart cards equipped with the ability to securely store e-ID data compliant with ICAO standards. The card can be used by citizens to authenticate with banks and governmental entities.
Infineon provided the SLC37 security controller with these features enabled by the newest 40nm security chip technology and creative dual-interface packaging. Memory size and multi-interface are two major themes in the development of government identification cards.
As a result, the creation and extension of several smart card applications for the Vietnam eID are supported by the SLC37 security controller’s high memory size and dual interface capabilities.
The government and business sector may easily and swiftly add new apps to enhance the utilisation of the National ID thanks to MK’s operating system, which was developed and supported in Vietnam.The ASEAN region’s next fast-growing market is Vietnam. The development and expansion of Infineon’s competence in areas like payments, transportation, and secure smart city solutions have all been made possible by their national eID initiative.
When creating local content for the most cutting-edge security chip available, Infineon may draw on its extensive experience working with local market leaders and its comprehension of the requirements.
With its 40nm process technology, TSMC became the first foundry to mass produce a range of devices for numerous clients. The 40nm process combines ultra-low-k connection material with 193 nm immersion lithography technology to improve chip performance while concurrently reducing power consumption. The smallest SRAM) and macro size were also records set by this technology.
Raw gate densities in the 40nm General Purpose (GP) and Low Power (LP) technologies are 235 percent higher than in the 65nm technology. The 40nm GP performs up to 40% better than its 65nm version at the same level of leakage current and at half the power consumption while operating at the same speed.
When operating at the same speed, the 40nm LP technology reduces leakage current and power consumption compared to its 65nm version. To accommodate a wider range of client needs, TSMC expanded the application of their 40nm manufacturing technology. 40nm improved LP and 40nm Ultra Low Power (ULP) processes are recent innovations.
The 40nm improved LP process improves performance by up to 30% over the 40nm LP process, while the 40nm ULP process reduces leakage current by up to 70% and power consumption by up to 30%. High performance applications such as central processing units (CPUs), graphic processors, game consoles, networks, FPGAs, and hard disc drives are the focus of the 40nm GP process technology.
Smartphones, digital television (DTV), set-top boxes (Set-Top-Box), games, and wireless networking applications are the focus of the 40nm LP and 40nm improved LP processes. Applications for wearable technology and the Internet of Things can also benefit from the 40nm ULP process.
The government would partner with a group of eight top Japanese corporations, including Toyota Motor and Sony Group, to build manufacturing procedures for next-generation semiconductors. The new business will offer a platform for cooperation with American businesses and agencies as global competition for next-generation semiconductor technology heats up.
Denso, a supplier to Toyota, NTT, Kioxia Holdings, NEC, and SoftBank are a few of the businesses anticipated to contribute to the initiative, each contributing roughly 1 billion yen. The new company was founded under the direction of Tetsuro Higashi, the former president of chip equipment manufacturer Tokyo Electron.
Additionally, MUFG Bank will take part, and the new business will seek out additional investment and collaboration from other companies. Japan still has to catch up. The company’s newest 40-nm chip production lines are for logic semiconductors. Since there has been fierce rivalry in new technologies, Japan has not been able to keep up with the significant investments made by foreign businesses and other governments.
