Global Abrasive free Planarization Market Size, Share and Forecasts 2030

Key Findings

• Abrasive free Planarization (AFP), also known as chemical mechanical polishing without abrasives, uses selective chemical etching and fluid dynamics to achieve ultra-flat surfaces without damaging underlying layers.
• This technique has gained traction in advanced semiconductor manufacturing, particularly in sub-5nm node processes where particle contamination and mechanical defects from traditional CMP (Chemical Mechanical Planarization) must be minimized.
• AFP enables defect-free surface planarization in logic, DRAM, and 3D NAND structures, ensuring high yield and structural integrity in multi-layer patterning processes.
• The method is especially valuable in fabricating delicate structures such as gate-all-around FETs, finFETs, and advanced packaging (2.5D/3D IC), where conventional abrasives risk delamination or surface damage.
• The rise in heterogeneous integration, chiplet architectures, and die stacking technologies further fuels the need for ultra-clean, low-defect planarization techniques.
• Abrasive-free technologies are also being explored for polishing compound semiconductors, optical substrates, and MEMS devices, broadening their market scope.
• Major industry players such as Ebara Corporation, Cabot Microelectronics, Applied Materials, and Fujimi Incorporated are developing proprietary AFP slurries and processes optimized for specific materials like silicon, GaN, and sapphire.
• North America and Asia-Pacific dominate AFP adoption due to high semiconductor fab activity, with key R&D hubs in Japan, South Korea, Taiwan, and the U.S.
• Emerging research focuses on environmentally friendly chemistries and fluidic-based planarization approaches with closed-loop control systems.
  The technology is transitioning from niche R&D to pilot-line and high-volume manufacturing adoption as node scaling challenges grow more complex.

Market Overview

Abrasive free Planarization represents a breakthrough in surface preparation, offering a non-mechanical, chemically driven alternative to traditional CMP. It eliminates abrasive particles from the polishing slurry, minimizing surface scratches, contamination, and material loss.This approach is increasingly crucial in next-generation semiconductor devices, where even nanometer-scale defects can result in critical yield losses. AFP enables more precise control over film removal rates and uniformity, making it ideal for complex device architectures and new materials integration.In high-volume manufacturing environments, abrasive-free methods reduce defectivity and increase wafer throughput by lowering cleaning and rework requirements. The technology is especially useful for thin-film materials, low-k dielectrics, and fragile III-V compound semiconductors.As the semiconductor industry approaches atomic-scale fabrication, planarization processes must evolve. AFP offers a scalable, low-damage alternative that aligns with industry needs for higher fidelity and reliability.

Abrasive free Planarization Market Size and Forecast

The global Abrasive free Planarization market was valued at USD 270 million in 2024 and is projected to reach USD 890 million by 2030, growing at a CAGR of 21.8% during the forecast period.Market expansion is driven by increased deployment in advanced logic and memory nodes, particularly in foundries and IDMs transitioning to 5nm, 3nm, and beyond. The surge in 3D integration and heterogeneous packaging is also catalyzing demand.Advanced slurry chemistries, improved tool architectures, and customized endpoint control systems are enabling higher process repeatability and reduced wafer scrap, accelerating industry adoption.

Future Outlook From Abrasive free Planarization Market

As semiconductor devices grow more complex, Abrasive free Planarization is set to play a critical role in ensuring layer integrity, device reliability, and cost-efficiency. Over the next five years, AFP will transition from advanced research applications to mainstream adoption in volume manufacturing.Breakthroughs in reactive slurry chemistry, machine learning-based process control, and atomic-level etching are expected to further enhance AFP capability and adoption. Equipment OEMs and chemical suppliers will continue to co-develop integrated solutions for different substrate types and metallization schemes.The technology’s potential in non-semiconductor fields such as optics, displays, and photonics will contribute to its market diversification. Sustainability initiatives will also favor AFP due to its lower slurry consumption and reduced waste compared to traditional CMP. Strategic collaborations between material suppliers, equipment manufacturers, and foundries will drive standardization and scalability. As planarization challenges intensify, AFP will emerge as a foundational process in next-gen manufacturing.

Abrasive free Planarization Market Trends

• Rise of AFP in Advanced Node Semiconductor Fabrication: As semiconductor nodes shrink below 5nm, the margin for error in planarization processes narrows dramatically. Abrasive free Planarization provides a defect-free surface preparation technique that is better suited for complex structures like gate-all-around and stacked transistors. Traditional CMP techniques introduce microscratches and defects that compromise yield at these scales. AFP avoids such issues, making it a critical enabler for continued node scaling. Manufacturers are investing in AFP tools and chemistry to maintain competitiveness in cutting-edge process nodes.
• Emergence of AFP in Compound Semiconductor Processing: The shift toward wide-bandgap semiconductors such as GaN and SiC in power electronics has introduced materials that are brittle and prone to chipping under mechanical polishing. AFP methods provide a gentler approach to planarization, ideal for these materials. Additionally, as optical devices and photonic ICs become more mainstream, the need for ultra-smooth, damage-free surfaces grows. AFP is gaining traction in compound semiconductor fabs looking for low-defect, high-precision planarization without damaging sensitive layers.
• Growth in 2.5D/3D Integration and Heterogeneous Packaging:AFP’s role is expanding beyond front-end wafer processing to backend packaging applications, particularly where ultra-flat surfaces are required for wafer-to-wafer or die-to-wafer bonding. In 2.5D interposers and 3D stacked dies, surface uniformity and cleanliness are essential to ensure electrical continuity and thermal management. Abrasive-free techniques help mitigate issues caused by dishing, erosion, and contamination. Toolmakers are developing AFP modules for integration into advanced packaging lines, driving adoption in OSATs and foundries.
• Environmental and Yield Advantages Driving Industrial Adoption: Abrasive free Planarization consumes fewer resources and generates less waste than traditional abrasive CMP. With rising focus on green manufacturing and ESG compliance, fabs are prioritizing eco-friendly solutions. AFP reduces post-polishing cleaning needs and slurry disposal, making it a more sustainable option. Yield improvements from reduced defectivity further enhance its ROI. Equipment vendors are responding by offering AFP systems with lower total cost of ownership, which is driving broader interest from fabs across regions.

Abrasive free Planarization Market Growth Drivers

• Shrinking Semiconductor Nodes and Complex Device Architectures: As process nodes advance toward 3nm and below, traditional planarization methods struggle to meet the defectivity and uniformity requirements. AFP addresses this by eliminating abrasive-induced defects and enabling superior surface smoothness. Devices such as finFETs and nanosheets benefit greatly from such precision. With chipmakers targeting performance gains through 3D stacking and gate-all-around structures, AFP has become an essential part of the process toolkit.
• Need for High-Yield, Low-Defect Manufacturing Processes: In semiconductor production, even minor defects can lead to significant yield loss. Abrasive free Planarization offers a defect-free surface preparation method, which reduces line stoppages and rework. This helps fabs achieve better cost-per-wafer metrics. In high-volume environments, the cumulative gains from improved yield are substantial. AFP also helps reduce edge chipping and delamination in fragile materials, further contributing to yield stability.
• Adoption in Specialty Substrates and Advanced Materials: The use of III-V materials, sapphire, and low-k dielectrics is increasing in high-performance and RF devices. These materials are sensitive to mechanical stress and require gentle planarization. AFP is uniquely suited for these use cases. As fabs diversify material sets, they require a universal planarization approach that minimizes mechanical interaction. AFP fills this role and ensures compatibility with next-generation substrate stacks.
• Support from Equipment and Chemical Ecosystems: Leading equipment providers and chemical suppliers are investing in R&D to create AFP solutions tailored for different materials and applications. The collaboration between process engineers, slurry developers, and tool vendors has resulted in robust solutions for volume deployment. Modular AFP tools now offer tight endpoint control, process repeatability, and integration with metrology systems. These developments reduce the risk of implementation and accelerate adoption across fabs.

Challenges in the Abrasive free Planarization Market

• Limited Process Standardization Across Substrates and Applications: Unlike conventional CMP, Abrasive free Planarization lacks universal process recipes. Each material and layer stack requires custom chemistries and process tuning. This makes adoption more complex for fabs with diverse product lines. Engineers must invest time and resources in qualification and calibration. The lack of standardized benchmarks also slows cross-industry collaboration and learning.
• Higher Initial Equipment and Development Costs: AFP systems often require more sophisticated fluid dynamics control, endpoint detection, and chemical delivery systems. These contribute to higher capital expenditure compared to traditional CMP tools. Additionally, new slurry formulations can be costly and require validation. The cost factor can deter small and mid-sized fabs from transitioning. ROI must be justified by improved yield, sustainability, or performance gains.
• Throughput and Scalability Concerns in High-Volume Production: While AFP offers lower defectivity, its material removal rate is typically slower than abrasive CMP, especially on hard materials. This can limit throughput in high-volume environments. Toolmakers are addressing this with improved chemistry and multi-wafer platforms, but challenges remain. Fabs must weigh the trade-off between process time and yield benefits. Process integration with other fab steps also requires careful scheduling.
• Knowledge and Expertise Barriers in Implementation: AFP is a relatively new technology compared to traditional CMP, and few process engineers have extensive experience with it. Adoption requires specialized knowledge in chemical interactions, fluid modeling, and endpoint control. Training and talent development become important for successful deployment. Without internal champions or vendor support, fabs may face a steep learning curve during implementation.

Abrasive free Planarization Market Segmentation

By Material Type

• Silicon
• III-V Semiconductors (e.g., GaN, InP)
• Sapphire
• Low-k Dielectrics
• Glass & Optical Substrates

By Application

• Advanced Logic (5nm, 3nm, and below)
• DRAM and 3D NAND
• 2.5D/3D IC Packaging
• MEMS and Sensors
• Compound Semiconductor Devices
• Photonics and Optical Components

By End-User Industry

• Semiconductor Foundries
• Integrated Device Manufacturers (IDMs)
• OSATs (Outsourced Semiconductor Assembly and Test)
• Optical & Photonic Device Manufacturers
• Research Institutions & National Labs

By Region

• North America
• Europe
• Asia-Pacific
• Rest of the World (ROW)

Leading Players

• Ebara Corporation
• Cabot Microelectronics Corporation (CMC Materials)
• Fujimi Incorporated
• Applied Materials, Inc.
• Lapmaster Wolters
• Air Products and Chemicals, Inc.
• Entegris, Inc.
• RENA Technologies
• Hitachi High-Tech Corporation
• Nanometrics (Onto Innovation)

Recent Developments

• Ebara Corporation launched a new generation AFP tool designed for 3nm and beyond, featuring real-time fluid modeling and endpoint control.
• Fujimi introduced a novel AFP slurry formulation optimized for low-k dielectrics, reducing surface defects by over 80%.
• Applied Materials announced a collaboration with major foundries to co-develop AFP solutions for 2.5D interposer processing.
• CMC Materials developed an eco-friendly, high-selectivity AFP chemistry for compound semiconductors in Q1 2024.
• Hitachi High-Tech expanded its metrology-integrated AFP platform for MEMS and photonics manufacturing.