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Last Updated: Apr 25, 2025 | Study Period: 2024-2030
A broad category of unique techniques known as advanced Packaging Inspection System includes 2.5D, 3D-IC, fan-out Advanced Packaging Inspection System, and system-in-package.
Although packing many chips together has been used for many years, Moore's Law is the primary force behind improved packaging. The distance that a signal must travel through narrow wires to get from one end of a chip to another is growing at each node as wires and transistors both get smaller.
The speed of those signals can be raised and the energy needed to drive those signals can be decreased by linking these chips with fatter pipes, which can be in the form of through-silicon vias, interposers, bridges, or plain wires. Furthermore, the quantity varies depending on the package.
The Global Advanced Packaging Inspection System market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
In Advanced Packaging Inspection System applications like 3D IC and high-density fan-out (HDFO), the Kronos 1190 patterned wafer Advanced Packaging Inspection System with high-resolution optics offers best-in-class sensitivity to crucial flaws for process development and production monitoring.
In order to solve the issues of overkill and defect escapes, DefectWise integrates Artificial Intelligence (AI) as a system-level solution, offering a significant gain in sensitivity, productivity, and classification accuracy.
With direct design input, DesignWise improves the FlexPointTM precisely focused inspection regions to further reduce annoyance. The Kronos 1190 system allows for cost-effective defect inspection down to 150 nm in crucial process phases such post-dicing, pre-bonding, patterning of Cu pads, Cu pillars, bumps, through silicon vias (TSVs), and redistribution layers (RDL). It also supports bonded, thinned, warped, and diced substrates.
CIRCLE-AP is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient Advanced Packaging Inspection System process control.
The CIRCLE-APP tool is utilized for multiple AWLP applications requiring high sensitivity including 2.5D/3D integration, wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP). With support for bonded, thinned and warped substrates, CIRCLE-APP provides production-proven process control and monitoring strategies for Cu-pillars, bumps, through silicon vias (TSVs), redistribution layer (RDL) and other packaging process flows.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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