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Last Updated: Apr 25, 2025 | Study Period:
To produce features for 2.5D and 3D advanced packages, Advanced packaging lithography system employs a step, settle, and illuminate technique. To build multiplayer features, these operations are repeated from die to die on a single wafer, from wafer to wafer on the same machine, and finally from machine to machine on the factory floor.
Advanced packages' complicated 2.5D and 3D structures must be built up over a large number of exposures using several reticles, which might slow down the process. By making dies larger, the industry has attempted to counteract poorer throughput by processing fewer die per wafer, which cuts down on Advanced packaging lithography system
Larger die, however, call for a higher level of surface positioning precision. Theta stage with high accuracy and dynamic capabilities, innovative Z Tip Tilt (ZTT), and excellent alignment and accuracy between the die and the die surface.
The ZTT stage has focusing capabilities that enable it to dynamically keep the wafer in the proper Z position. By addressing the alignment and accuracy problems, these capabilities permit the use of larger die in sophisticated packaging.
Increasing the speed of wafer movement in between flash illuminations is another technique to boost throughput. For moving masses in the XY direction, air bearing motion stage typically accelerates at 1-2g with a jerk time of a few milliseconds.
The Global Advanced packaging lithography system market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The FPA-5520iV LF2 Option for back-end process semiconductor Advanced packaging lithography system i-line stepper1 systems, which contributes to 3D advanced packaging technologies with a resolution of 0.8 m (micrometer2) and a wide exposure field of 100 mm x 100 mm, was just launched in Japan, according to canon Inc.
Higher-density packing in back-end processes is gaining more attention in the area of improving the performance of semiconductor chips, coupled with the downsizing of circuits in the front-end process of semiconductor production.
In order to achieve fine rewiring for Advanced packaging lithography systems that deliver high performance, semiconductor lithography methods have been adopted recently.
In order to increase semiconductor performance, "2.5D technology3" and "3D technology4", both of which incorporate semiconductor chips with exceptionally high die-to-die connection densities, are being used.
| Sl no | Topic |
| 1 | Market Segmentation |
| 2 | Scope of the report |
| 3 | Abbreviations |
| 4 | Research Methodology |
| 5 | Executive Summary |
| 6 | Introduction |
| 7 | Insights from Industry stakeholders |
| 8 | Cost breakdown of Product by sub-components and average profit margin |
| 9 | Disruptive innovation in the Industry |
| 10 | Technology trends in the Industry |
| 11 | Consumer trends in the industry |
| 12 | Recent Production Milestones |
| 13 | Component Manufacturing in US, EU and China |
| 14 | COVID-19 impact on overall market |
| 15 | COVID-19 impact on Production of components |
| 16 | COVID-19 impact on Point of sale |
| 17 | Market Segmentation, Dynamics and Forecast by Geography, 2024-2030 |
| 18 | Market Segmentation, Dynamics and Forecast by Product Type, 2024-2030 |
| 19 | Market Segmentation, Dynamics and Forecast by Application, 2024-2030 |
| 20 | Market Segmentation, Dynamics and Forecast by End use, 2024-2030 |
| 21 | Product installation rate by OEM, 2023 |
| 22 | Incline/Decline in Average B-2-B selling price in past 5 years |
| 23 | Competition from substitute products |
| 24 | Gross margin and average profitability of suppliers |
| 25 | New product development in past 12 months |
| 26 | M&A in past 12 months |
| 27 | Growth strategy of leading players |
| 28 | Market share of vendors, 2023 |
| 29 | Company Profiles |
| 30 | Unmet needs and opportunity for new suppliers |
| 31 | Conclusion |
| 32 | Appendix |
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