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Systems for Advanced Packaging Metrology With the ability to perform a wide range of measurements on a single system thanks to multi-mode optics, time and money are saved, and the high-resolution 3D images and analysis that follow give the information needed to enable process feedback loops that enhance yield.
Modern chip production and advanced packaging methods are more challenging than ever with the advent of chiplet integration.
The integration of dies from various wafers presents a challenge for yield management. It necessitates the use of metrology, which combines electrical testing and optical measuring. Additionally, hybrid metrology with multi-sensor technologies is required.
For high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL), and other packaging processes, an advanced semiconductor packaging metrology system offers an unequalled combination of speed, accuracy, and precision.
The size, shape, and material options for interconnects for advanced packaging are expanding. To ensure trustworthy connections throughout the bonding process, it is crucial to monitor the device and wafer’s height, diameter, shape, and absence or presence of these interconnects.
Although solder bump methods have been used in the past, they are unable to provide the necessary high-density interconnects. Copper pillar posts and TSV posts are new connectivity technologies being used for wafer-level packaging (WLP) and through silicon via (TSV) packages.
Global advanced packaging metrology systems market accounted for $XX Billion in 2023 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2024 to 2030.
The new 3D and 2D WX3000 Metrology and Inspection systems for wafer-level and advanced packaging applications, enabled by Multi-Reflection Suppression (MRS), will be unveiled by CyberOptics, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, at the virtual SEMICON West show.
To increase yields and productivity, the WX3000 Metrology and Inspection systems provide the ideal balance of high speed, high resolution, and high accuracy for wafer-level and advanced packaging.
The WX3000 systems with NanoResolution MRS sensors enable throughput of over 25 wafers per hour. Compared to a different, slower technology that needs two separate scans for 3D and 2D and only a sampling of a few die, 100% 3D and 2D metrology and inspection can be finished simultaneously at high speed.
