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Last Updated: Apr 25, 2025 | Study Period: 2020-2030
Crucial aerospace applications, such as engine control systems for aircraft, employ high-temperature electronics. When system designers need parts that function dependably in challenging circumstances and a wide range of temperatures, aircraft high-temperature microelectronics offer great versatility.
For improved design engineering feedback and lower testing and maintenance costs, sensors and control systems mounted on or within aircraft engines must operate at temperatures between 500 and 600 degrees Celsius for periods of up to 100 hours. Performance improvements in supersonic aircraft are already severely hampered by the integration of the added weight of the necessary cooling system for Si devices.
In addition to satisfying these current needs, the creation of devices suited for use in hot conditions would open up several new opportunities for distributed feedback control applications.
The Global aircraft high temperature microelectronics market accounted for $XX Billion in 2021 and is anticipated to reach $XX Billion by 2030, registering a CAGR of XX% from 2022 to 2030.
The cooperation between SAE International and JEDEC Solid State Technology Association has been formalised with the signing of a Cooperation Agreement that will enable the use of microelectronics in crucial applications spanning the aviation, space, and defence sectors.
A new power supply for the next generation of inertial navigation systems is being designed at TT Electronics' Kansas City facility, according to a letter of authority from longtime partner Honeywell Aerospace. TT Electronics is a global provider of engineered technologies for performance-critical applications.
This most recent step strengthens the strategic alliance between TT Electronics and Honeywell, two businesses that have been working together on several projects. During this time, TT has provided a range of cutting-edge solutions to meet Honeywell's needs for its aerospace and defence customers around the world.
Sl no | Topic |
1 | Market Segmentation |
2 | Scope of the report |
3 | Abbreviations |
4 | Research Methodology |
5 | Executive Summary |
6 | Introduction |
7 | Insights from Industry stakeholders |
8 | Cost breakdown of Product by sub-components and average profit margin |
9 | Disruptive innovation in the Industry |
10 | Technology trends in the Industry |
11 | Consumer trends in the industry |
12 | Recent Production Milestones |
13 | Component Manufacturing in US, EU and China |
14 | COVID-19 impact on overall market |
15 | COVID-19 impact on Production of components |
16 | COVID-19 impact on Point of sale |
17 | Market Segmentation, Dynamics and Forecast by Geography, 2022-2030 |
18 | Market Segmentation, Dynamics and Forecast by Product Type, 2022-2030 |
19 | Market Segmentation, Dynamics and Forecast by Application, 2022-2030 |
20 | Market Segmentation, Dynamics and Forecast by End use, 2022-2030 |
21 | Product installation rate by OEM, 2022 |
22 | Incline/Decline in Average B-2-B selling price in past 5 years |
23 | Competition from substitute products |
24 | Gross margin and average profitability of suppliers |
25 | New product development in past 12 months |
26 | M&A in past 12 months |
27 | Growth strategy of leading players |
28 | Market share of vendors, 2022 |
29 | Company Profiles |
30 | Unmet needs and opportunity for new suppliers |
31 | Conclusion |
32 | Appendix |